| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR16-HZL-TTCONN IC DIP SOCKET 16POS TIN |
4,631 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
A48-LC-TRCONN IC DIP SOCKET 48POS TIN |
4,938 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
|
AW 127-15/Z-TSOCKET 15 CONTACTS SINGLE ROW |
1,797 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
116-87-304-41-003101CONN IC DIP SOCKET 4POS GOLD |
1,171 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
114-83-304-41-117101CONN IC DIP SOCKET 4POS GOLD |
3,464 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
A 42-LC-TRSOCKET |
4,810 |
|
Datasheet |
A | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
|
114-87-306-41-117101CONN IC DIP SOCKET 6POS GOLD |
4,657 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
114-87-306-41-134161CONN IC DIP SOCKET 6POS GOLD |
3,857 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP1X08-011BSIP1X08-011B-SIP SOCKET 8 CTS |
4,312 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 8 (1 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
110-83-304-41-005101CONN IC DIP SOCKET 4POS GOLD |
4,991 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
01-0513-11CONN SOCKET SIP 1POS GOLD |
3,018 |
|
Datasheet |
0513 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Through Hole | - | Solder | - | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
02-1518-00CONN IC DIP SOCKET 2POS GOLD |
3,116 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
115-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
1,530 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
AR 22-HZL-TTSOCKET |
1,301 |
|
Datasheet |
- | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 196.9µin (5.00µm) | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
|
|
AW 127-16/Z-TSOCKET 16 CONTACTS SINGLE ROW |
4,917 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
AR08-HZL/07-TTCONN IC DIP SOCKET 8POS GOLD |
3,681 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
|
HLS-0101-T-10.100" SCREW MACHINE SOCKET ARRAY |
2,654 |
|
Datasheet |
HLS | Tube | Active | SIP | 1 (1 x 1) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
SA1000300000GSA-7.43- 10P ; CLIP:TIN200U" PI |
1,227 |
|
Datasheet |
SU | Bulk | Active | SIP | 10 | Tin | 200.0µin (5.08µm) | Brass | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Beryllium Copper |
|
|
02-0518-10HCONN SOCKET SIP 2POS GOLD |
1,175 |
|
Datasheet |
518 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
02-0518-10TCONN SOCKET SIP 2POS GOLD |
1,196 |
|
Datasheet |
518 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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