| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
146-87-314-41-035101CONN IC DIP SOCKET 14POS GOLD |
4,168 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-87-314-41-036101CONN IC DIP SOCKET 14POS GOLD |
2,182 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP050-1X21-157B1X21-157B-SIP SOCKET 21 CTS |
1,405 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 21 (1 x 21) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
410-87-228-10-001101CONN ZIG-ZAG 28POS GOLD |
3,482 |
|
Datasheet |
410 | Bulk | Active | Zig-Zag, Left Stackable | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
410-87-228-10-002101CONN ZIG-ZAG 28POS GOLD |
4,197 |
|
Datasheet |
410 | Bulk | Active | Zig-Zag, Right Stackable | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-314-41-008101CONN IC DIP SOCKET 14POS GOLD |
1,536 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP1X27-001BSIP1X27-001B-SIP SOCKET 27 CTS |
2,091 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 27 (1 x 27) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
AR64-HZL-TTCONN IC DIP SOCKET 64POS TIN |
4,846 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
917-83-108-41-053101CONN TRANSIST TO-5 8POS GOLD |
4,958 |
|
Datasheet |
917 | Bulk | Active | Transistor, TO-5 | 8 (Round) | Gold | 29.5µin (0.75µm) | Beryllium Copper | - | Through Hole | - | Solder | - | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
08-3518-10MCONN IC DIP SOCKET 8POS GOLD |
1,252 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
06-2513-11CONN IC DIP SOCKET 6POS GOLD |
2,387 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
16-1518-10TCONN IC DIP SOCKET 16POS GOLD |
3,179 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
612-87-322-41-001101CONN IC DIP SOCKET 22POS GOLD |
3,737 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP050-1X18-160B1X18-160B-SIP SOCKET 18 CTS |
4,147 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 18 (1 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
400-028-000CONN IC DIP SOCKET 28POS GOLD |
4,523 |
|
Datasheet |
400 | - | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 8.00µin (0.203µm) | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | 8.00µin (0.203µm) | - | - |
|
917-87-210-41-053101CONN TRANSIST TO-5 10POS GOLD |
1,175 |
|
Datasheet |
917 | Bulk | Active | Transistor, TO-5 | 10 (Round) | Gold | Flash | Beryllium Copper | - | Through Hole | - | Solder | - | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
110-87-316-41-105191CONN IC DIP SOCKET 16POS GOLD |
3,307 |
|
Datasheet |
110 | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-610-41-009101CONN IC DIP SOCKET 10POS GOLD |
4,011 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
08-3513-11CONN IC DIP SOCKET 8POS GOLD |
1,136 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
116-83-308-41-011101CONN IC DIP SOCKET 8POS GOLD |
4,646 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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