| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
122-87-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
3,558 |
|
Datasheet |
122 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
110-87-422-41-105101CONN IC DIP SOCKET 22POS GOLD |
4,896 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
130-028-050CONN IC DIP SOCKET 28POS GOLD |
4,803 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
110-83-316-41-105101CONN IC DIP SOCKET 16POS GOLD |
4,329 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
917-83-108-41-005101CONN TRANSIST TO-5 8POS GOLD |
2,236 |
|
Datasheet |
917 | Bulk | Active | Transistor, TO-5 | 8 (Round) | Gold | 29.5µin (0.75µm) | Beryllium Copper | - | Through Hole | - | Solder | - | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SMPX-44LCC-PSMT PLCC SOCKET 44P POLARISED RO |
1,194 |
|
Datasheet |
SMPX | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | -50°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
|
HLS-0104-G-2.100" SCREW MACHINE SOCKET ARRAY |
2,262 |
|
Datasheet |
HLS | Tube | Active | SIP | 4 (1 x 4) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 140°C | 10.0µin (0.25µm) | Thermoplastic | - |
|
540-99-068-17-400000CONN SOCKET PLCC 68POS TIN-LEAD |
2,730 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin-Lead | 200.0µin (5.08µm) | - | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | - |
|
|
540-99-068-17-400200CONN SOCKET PLCC 68POS TIN-LEAD |
1,866 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin-Lead | 200.0µin (5.08µm) | - | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | - |
|
116-83-314-41-003101CONN IC DIP SOCKET 14POS GOLD |
4,137 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
114-83-318-41-117101CONN IC DIP SOCKET 18POS GOLD |
2,090 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
114-83-318-41-134161CONN IC DIP SOCKET 18POS GOLD |
1,039 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
14-0513-10TCONN SOCKET SIP 14POS GOLD |
1,925 |
|
Datasheet |
0513 | Bulk | Active | SIP | 14 (1 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
18-0518-10CONN SOCKET SIP 18POS GOLD |
1,509 |
|
Datasheet |
518 | Bulk | Active | SIP | 18 (1 x 18) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
115-87-428-41-003101CONN IC DIP SOCKET 28POS GOLD |
4,770 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
AR28-HZW/TCONN IC DIP SOCKET 28POS GOLD |
2,322 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
|
SIP1X32-001BSIP1X32-001B-SIP SOCKET 32 POS |
4,303 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 32 (1 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
614-87-320-31-012101CONN IC DIP SOCKET 20POS GOLD |
1,549 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
614-87-420-31-012101CONN IC DIP SOCKET 20POS GOLD |
1,838 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
643644-6CONN SOCKET SIP 12POS TIN |
3,541 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
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