| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
C9108-00CONN IC DIP SOCKET 8POS GOLD |
2,056 |
|
Datasheet |
Edge-Grip™, C91 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
14-0513-10CONN SOCKET SIP 14POS GOLD |
3,062 |
|
Datasheet |
0513 | Bulk | Active | SIP | 14 (1 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
20-1518-10CONN IC DIP SOCKET 20POS GOLD |
4,144 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
114-87-328-41-134191CONN IC DIP SOCKET 28POS GOLD |
2,536 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
612-83-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
3,247 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
110-87-324-41-105161CONN IC DIP SOCKET 24POS GOLD |
3,630 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
110-024-050CONN IC DIP SOCKET 24POS GOLD |
3,406 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
A-ICS-254-12-TT50IC SOCKET, MACHINED PIN, 7.62MM, |
1,143 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 78.7µin (2.00µm) | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
|
110-83-314-41-105191CONN IC DIP SOCKET 14POS GOLD |
2,497 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
124-83-310-41-002101CONN IC DIP SOCKET 10POS GOLD |
4,057 |
|
Datasheet |
124 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
A48-LCG-T-RCONN IC DIP SOCKET 48POS GOLD |
3,795 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
16-3511-10CONN IC DIP SOCKET 16POS TIN |
1,803 |
|
Datasheet |
511 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
4603CONN TRANSIST TO-3 3POS TIN |
4,630 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Oval) | Tin | - | Brass | - | Chassis Mount | Closed Frame | Solder | - | Tin | - | - | Polyester, Glass Filled | Brass |
|
3-822516-7CONN SOCKET PLCC 32POS TIN |
4,743 |
|
Datasheet |
- | Tape & Reel (TR) | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | 100.0µin (2.54µm) | Thermoplastic | Phosphor Bronze |
|
D2922-42CONN IC DIP SOCKET 22POS GOLD |
4,823 |
|
Datasheet |
D2 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Plastic | Brass |
|
299-87-308-11-001101CONN IC DIP SOCKET 8POS GOLD |
4,889 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-210-41-011101CONN IC DIP SOCKET 10POS GOLD |
4,974 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-324-41-006101CONN IC DIP SOCKET 24POS GOLD |
1,205 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
410-83-220-10-001101CONN ZIG-ZAG 20POS GOLD |
2,104 |
|
Datasheet |
410 | Bulk | Active | Zig-Zag, Left Stackable | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
410-83-220-10-002101CONN ZIG-ZAG 20POS GOLD |
1,907 |
|
Datasheet |
410 | Bulk | Active | Zig-Zag, Right Stackable | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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