| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
540-99-084-17-400000CONN SOCKET PLCC 84POS TIN-LEAD |
2,222 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin-Lead | 200.0µin (5.08µm) | - | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | - |
|
HLS-0303-TT-11.100" SCREW MACHINE SOCKET ARRAY |
4,387 |
|
Datasheet |
HLS | Tube | Active | SIP | 9 (3 x 3) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 140°C | - | Thermoplastic | - |
|
110-83-328-01-762101CONN IC DIP SOCKET 28POS GOLD |
2,273 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14), 16 Loaded | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
117-87-620-41-105101CONN IC DIP SOCKET 20POS GOLD |
1,204 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
614-87-322-31-012101CONN IC DIP SOCKET 22POS GOLD |
2,201 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
614-83-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
2,396 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
10-0513-10HCONN SOCKET SIP 10POS GOLD |
4,374 |
|
Datasheet |
0513 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
04-0503-20CONN SOCKET SIP 4POS GOLD |
1,684 |
|
Datasheet |
0503 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
|
|
04-0503-30CONN SOCKET SIP 4POS GOLD |
2,299 |
|
Datasheet |
0503 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
|
|
20-0518-10CONN SOCKET SIP 20POS GOLD |
1,443 |
|
Datasheet |
518 | Bulk | Active | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
510-87-044-08-031101CONN SOCKET PGA 44POS GOLD |
3,321 |
|
Datasheet |
510 | Bulk | Active | PGA | 44 (8 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-87-316-41-035101CONN IC DIP SOCKET 16POS GOLD |
3,273 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-87-316-41-036101CONN IC DIP SOCKET 16POS GOLD |
1,405 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
917-87-210-41-005101CONN TRANSIST TO-5 10POS GOLD |
4,205 |
|
Datasheet |
917 | Bulk | Active | Transistor, TO-5 | 10 (Round) | Gold | Flash | Beryllium Copper | - | Through Hole | - | Solder | - | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
917-83-208-41-005101CONN TRANSIST TO-5 8POS GOLD |
3,810 |
|
Datasheet |
917 | Bulk | Active | Transistor, TO-5 | 8 (Round) | Gold | 29.5µin (0.75µm) | Beryllium Copper | - | Through Hole | - | Solder | - | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP050-1X24-157B1X24-157B-SIP SOCKET 24 CTS |
1,438 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 24 (1 x 24) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
114-83-320-41-134161CONN IC DIP SOCKET 20POS GOLD |
2,760 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-314-41-012101CONN IC DIP SOCKET 14POS GOLD |
4,487 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
AR20-HZL/01-TT-RCONN IC DIP SOCKET 20POS GOLD |
1,156 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
|
4-1437539-6CONN IC DIP SOCKET 18POS TINLEAD |
3,321 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin-Lead | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | - |
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