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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
110-87-636-41-105101

110-87-636-41-105101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

1,842
110-87-636-41-105101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-83-210-41-004101

116-83-210-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,504
116-83-210-41-004101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-87-610-41-013101

116-87-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,994
116-87-610-41-013101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
117-87-648-41-005101

117-87-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

1,459
117-87-648-41-005101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
1-1437542-0

1-1437542-0

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

4,314
1-1437542-0

Datasheet

700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 20.0µin (0.51µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 20.0µin (0.51µm) Aluminum Alloy Beryllium Copper
110-87-314-41-105191

110-87-314-41-105191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

4,194
110-87-314-41-105191

Datasheet

110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
HLS-0104-G-32

HLS-0104-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,027
HLS-0104-G-32

Datasheet

HLS Bulk Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
614-87-636-41-001101

614-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

1,552
614-87-636-41-001101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-87-320-41-001101

116-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

1,680
116-87-320-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
528-AG11D-ES

528-AG11D-ES

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

2,746
528-AG11D-ES

Datasheet

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 105°C - Polyester Copper Alloy
116-87-318-41-011101

116-87-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,691
116-87-318-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
ICA-308-WTT-3

ICA-308-WTT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,216
ICA-308-WTT-3

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C - Polyester, Glass Filled Brass
116-83-624-41-006101

116-83-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,009
116-83-624-41-006101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
500-032-050

500-032-050

CONN SOCKET SIP 32POS GOLD

3M

1,395
500-032-050

Datasheet

- Box Obsolete SIP 32 (1 x 32) Gold 8.00µin (0.203µm) - 0.100" (2.54mm) Through Hole Closed Frame - 0.100" (2.54mm) Gold - 8.00µin (0.203µm) - -
110-83-632-41-005101

110-83-632-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,951
110-83-632-41-005101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
110-83-632-41-605101

110-83-632-41-605101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,570
110-83-632-41-605101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
540-88-084-24-008

540-88-084-24-008

CONN SOCKET PLCC 84POS TIN

Preci-Dip

3,998
540-88-084-24-008

Datasheet

540 Bulk Active PLCC 84 (4 x 21) Tin - Phosphor Bronze 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Polyphenylene Sulfide (PPS) Phosphor Bronze
21-0513-10

21-0513-10

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,281
21-0513-10

Datasheet

0513 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
11-0513-11H

11-0513-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,412
11-0513-11H

Datasheet

0513 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
23-0513-10T

23-0513-10T

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,216
23-0513-10T

Datasheet

0513 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
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