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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
30-0518-10

30-0518-10

CONN SOCKET SIP 30POS GOLD

Aries Electronics

3,845
30-0518-10

Datasheet

518 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
08-0517-90C

08-0517-90C

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3,577
08-0517-90C

Datasheet

0517 Bulk Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper - Through Hole, Right Angle - Solder - Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
122-83-320-41-001101

122-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

1,352
122-83-320-41-001101

Datasheet

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-87-422-41-007101

116-87-422-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,027
116-87-422-41-007101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
AR 22-HZL/07/7-TT

AR 22-HZL/07/7-TT

SOCKET

Assmann WSW Components

2,079
AR 22-HZL/07/7-TT

Datasheet

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Brass 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C - Polybutylene Terephthalate (PBT), Glass Filled Brass
110-87-648-41-001101

110-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

4,315
110-87-648-41-001101

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
110-87-648-41-001151

110-87-648-41-001151

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,340
110-87-648-41-001151

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
612-83-422-41-001101

612-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

1,755
612-83-422-41-001101

Datasheet

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
614-87-432-31-012101

614-87-432-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,757
614-87-432-31-012101

Datasheet

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
HLS-0205-T-2

HLS-0205-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,517
HLS-0205-T-2

Datasheet

HLS Tube Active SIP 10 (2 x 5) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
HLS-0105-G-11

HLS-0105-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,317
HLS-0105-G-11

Datasheet

HLS Tube Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
AR 28-HZL/07/7-TT

AR 28-HZL/07/7-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

4,034
AR 28-HZL/07/7-TT

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 200.0µin (5.08µm) Thermoplastic, Polyester Beryllium Copper
146-87-322-41-036101

146-87-322-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,222
146-87-322-41-036101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
APH-0902-T-T

APH-0902-T-T

APH-0902-T-T

Samtec Inc.

2,005
APH-0902-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1402-T-T

APH-1402-T-T

APH-1402-T-T

Samtec Inc.

2,359
APH-1402-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1202-T-T

APH-1202-T-T

APH-1202-T-T

Samtec Inc.

4,781
APH-1202-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0802-T-T

APH-0802-T-T

APH-0802-T-T

Samtec Inc.

3,829
APH-0802-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1702-T-T

APH-1702-T-T

APH-1702-T-T

Samtec Inc.

3,801
APH-1702-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
08-3518-10E

08-3518-10E

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,518
08-3518-10E

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
110-87-632-41-105191

110-87-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,187
110-87-632-41-105191

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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