| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HLS-2007-T-10.100" SCREW MACHINE SOCKET ARRAY |
4,952 |
|
Datasheet |
HLS | Bulk | Active | SIP | 140 (20 x 7) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
116-83-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
4,859 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
121-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
4,437 |
|
Datasheet |
121 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
114-83-628-41-134161CONN IC DIP SOCKET 28POS GOLD |
2,610 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
04-0503-31CONN SOCKET SIP 4POS GOLD |
2,741 |
|
Datasheet |
0503 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
|
|
146-87-422-41-035101CONN IC DIP SOCKET 22POS GOLD |
4,874 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-87-422-41-036101CONN IC DIP SOCKET 22POS GOLD |
3,149 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-420-41-009101CONN IC DIP SOCKET 20POS GOLD |
4,121 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0203-T-32.100" SCREW MACHINE SOCKET ARRAY |
2,158 |
|
Datasheet |
HLS | Tube | Active | SIP | 6 (2 x 3) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
110-87-428-41-105101CONN IC DIP SOCKET 28POS GOLD |
1,428 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-424-41-002101CONN IC DIP SOCKET 24POS GOLD |
3,666 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-87-065-10-051101CONN SOCKET PGA 65POS GOLD |
1,048 |
|
Datasheet |
510 | Bulk | Active | PGA | 65 (10 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-87-065-10-052101CONN SOCKET PGA 65POS GOLD |
1,243 |
|
Datasheet |
510 | Bulk | Active | PGA | 65 (10 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
A-ICS-254-18-TT50IC SOCKET, MACHINED PIN, 7.62MM, |
2,072 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 78.7µin (2.00µm) | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
|
ICF-320-TL-O-TR.100" SURFACE MOUNT SCREW MACHIN |
1,630 |
|
Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
|
|
HLS-0107-T-11.100" SCREW MACHINE SOCKET ARRAY |
4,935 |
|
Datasheet |
HLS | Tube | Active | SIP | 7 (1 x 7) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
AR 36-HZL/07-TTSOCKET |
2,784 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
116-87-432-41-018101CONN IC DIP SOCKET 32POS GOLD |
2,117 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
612-83-324-41-001101CONN IC DIP SOCKET 24POS GOLD |
1,231 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0108-T-2.100" SCREW MACHINE SOCKET ARRAY |
2,807 |
|
Datasheet |
HLS | Tube | Active | SIP | 8 (1 x 8) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
Upload
