IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
115-43-308-41-001000

115-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

115
115-43-308-41-001000

Datasheet

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
210-1-20-003

210-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech

690
210-1-20-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 200.0µin (5.08µm) Polybutylene Terephthalate (PBT) Brass
115-93-308-41-001000

115-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

214
115-93-308-41-001000

Datasheet

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-47-318-41-001000

110-47-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

339
110-47-318-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-99-624-41-001000

110-99-624-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

365
110-99-624-41-001000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin-Lead 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-87-210-41-006101

116-87-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,275
116-87-210-41-006101

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
111-43-308-41-001000

111-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

445
111-43-308-41-001000

Datasheet

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
69802-044LF

69802-044LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)

4,288
69802-044LF

Datasheet

- Tube Active PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Phosphor Bronze 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin -55°C ~ 125°C 150.0µin (3.81µm) Polyphenylene Sulfide (PPS) Phosphor Bronze
115-47-316-41-001000

115-47-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

374
115-47-316-41-001000

Datasheet

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
A-CCS 020-Z-T

A-CCS 020-Z-T

IC SOCKET PLCC 20POS TIN

Assmann WSW Components

558
A-CCS 020-Z-T

Datasheet

- Tube Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Phosphor Bronze 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 160.0µin (4.06µm) Polybutylene Terephthalate (PBT) Phosphor Bronze
110-99-324-41-001000

110-99-324-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

445
110-99-324-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin-Lead 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICA-318-STT

ICA-318-STT

CONN IC DIP SOCKET 18POS TIN

Samtec Inc.

821
ICA-318-STT

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C - Polyester, Glass Filled Brass
A-CCS 028-G-T

A-CCS 028-G-T

CONN SOCKET PLCC 28POS GOLD

Assmann WSW Components

5,766
A-CCS 028-G-T

Datasheet

- Tube Active PLCC 28 (4 x 7) Gold - Phosphor Bronze 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -40°C ~ 105°C - Polybutylene Terephthalate (PBT) Phosphor Bronze
69802-144LF

69802-144LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)

13,720
69802-144LF

Datasheet

- Tube Active PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Phosphor Bronze 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin -55°C ~ 125°C 150.0µin (3.81µm) Polyphenylene Sulfide (PPS) Phosphor Bronze
16-3518-10T

16-3518-10T

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

434
16-3518-10T

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICA-308-SST

ICA-308-SST

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

101
ICA-308-SST

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polyester, Glass Filled Brass
ICO-314-SGT

ICO-314-SGT

CONN IC DIP SKT 14POS

Samtec Inc.

1,428
ICO-314-SGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
111-43-314-41-001000

111-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

6,630
111-43-314-41-001000

Datasheet

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
24-3518-10

24-3518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

274
24-3518-10

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
AW 127-06/G-T

AW 127-06/G-T

SOCKET, MACHINED CONTACTS, 1 ROW

Assmann WSW Components

867
AW 127-06/G-T

Datasheet

- Bag Active - - Gold Flash - 0.100" (2.54mm) Through Hole - Solder - Gold -40°C ~ 105°C Flash - -
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