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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1-2324271-1RIGHT SEGMEN LGA4189-4 SOCKET-P4 |
215 |
|
Datasheet |
- | Tray | Active | LGA 4189 | 2092 | Gold | 30.0µin (0.76µm) | Copper Alloy | 0.039" (1.00mm) | Surface Mount | Open Frame | Solder | 0.034" (0.86mm) | Gold | -25°C ~ 100°C | 30.0µin (0.76µm) | Thermoplastic | Copper Alloy |
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240-1288-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD |
2,308 |
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Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
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243-18-1-03CONN IC DIP SOCKET 18POS TIN |
2,108 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
243-24-1-06CONN IC DIP SOCKET 24POS TIN |
2,043 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 100.0µin (2.54µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
DILB24P-224TLFCONN IC DIP SOCKET 24POS TINLEAD |
10,133 |
|
Datasheet |
DILB | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
|
243-32-1-06CONN IC DIP SOCKET 32POS TIN |
1,109 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 100.0µin (2.54µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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114-87-308-41-117101CONN IC DIP SOCKET 8POS GOLD |
7,117 |
|
Datasheet |
114 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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ICA-308-STTCONN IC DIP SOCKET 8POS TIN |
3,085 |
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Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
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232-32-TRCONN SOCKET PLCC 32POS TIN |
4,228 |
|
Datasheet |
- | Tape & Reel (TR) | Active | PLCC | 32 (4 x 8) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
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4832-6004-CPCONN IC DIP SOCKET 32POS TIN |
810 |
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Datasheet |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -25°C ~ 85°C | 35.0µin (0.90µm) | Polyester, Glass Filled | Phosphor Bronze |
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210-1-14-003CONN IC DIP SOCKET 14POS GOLD |
532 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
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SA243000CONN IC DIP SOCKET 24POS GOLD |
351 |
|
Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Brass |
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210-1-16-003CONN IC DIP SOCKET 16POS GOLD |
298 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
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110-47-308-41-105000CONN IC DIP SOCKET 8POS GOLD |
287 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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07-0513-10CONN SOCKET SIP 7POS GOLD |
797 |
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Datasheet |
0513 | Bulk | Active | SIP | 7 (1 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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69802-032LFCONN SOCKET PLCC 32POS TIN |
1,534 |
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Datasheet |
- | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 125°C | 150.0µin (3.81µm) | Polyphenylene Sulfide (PPS) | Phosphor Bronze |
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ICO-308-SGTCONN IC DIP SOCKET 8POS GOLD |
721 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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114-87-316-41-134161CONN IC DIP SOCKET 16POS GOLD |
200 |
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Datasheet |
114 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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232-44-TRCONN SOCKET PLCC 44POS TIN |
392 |
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Datasheet |
- | Tape & Reel (TR) | Active | PLCC | 44 (4 x 11) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
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115-47-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
235 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
