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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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110-99-640-41-001000CONN IC DIP SOCKET 40POS TINLEAD |
181 |
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Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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AR 14-HZW/TNCONN IC DIP SOCKET 14POS GOLD |
446 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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4601CONN TRANSIST TO-3 3POS TIN |
1,308 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Oval) | Tin | - | Brass | - | Chassis Mount | Closed Frame | Solder | - | Tin | - | - | Polyester, Glass Filled | Brass |
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110-43-422-41-001000CONN IC DIP SOCKET 22POS GOLD |
257 |
|
Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-87-628-41-001151CONN IC DIP SOCKET 28POS GOLD |
443 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, No Center Bar | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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940-44-032-24-000000CONN SOCKET PLCC 32POS TIN |
3,238 |
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Datasheet |
940 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-43-316-10-003000CONN IC DIP SOCKET 16POS GOLD |
164 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8), 8 Loaded | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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A-CCS 052-G-TCONN SOCKET PLCC 52POS GOLD |
172 |
|
Datasheet |
- | Tube | Active | PLCC | 52 (4 x 13) | Gold | - | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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917-93-108-41-005000CONN TRANSIST TO-5 8POS GOLD |
151 |
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Datasheet |
917 | Tube | Active | Transistor, TO-5 | 8 (Round) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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AR 28-HZL/01-TTCONN IC DIP SOCKET 28POS GOLD |
9,678 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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8484-21B1-RK-TPCONN SOCKET PLCC 84POS TIN |
767 |
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Datasheet |
8400 | Tube | Active | PLCC | 84 (4 x 21) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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110-47-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
120 |
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Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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AR 40-HZL-TTCONN IC DIP SOCKET 40POS TIN |
2,702 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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110-43-324-41-001000CONN IC DIP SOCKET 24POS GOLD |
685 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-43-624-41-001000CONN IC DIP SOCKET 24POS GOLD |
428 |
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Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-93-624-41-001000CONN IC DIP SOCKET 24POS GOLD |
304 |
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Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-93-324-41-001000CONN IC DIP SOCKET 24POS GOLD |
249 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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8468-21B1-RK-TRCONN SOCKET PLCC 68POS TIN |
469 |
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Datasheet |
8400 | Tape & Reel (TR) | Active | PLCC | 68 (4 x 17) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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XR2A-1401-NCONN IC DIP SOCKET 14POS GOLD |
251 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 29.5µin (0.75µm) | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
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8484-11B1-RK-TPCONN SOCKET PLCC 84POS TIN |
388 |
|
Datasheet |
8400 | Tube | Active | PLCC | 84 (4 x 21) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
