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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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123-83-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
2,414 |
|
Datasheet |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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8420-21B1-RK-TPCONN SOCKET PLCC 20POS TIN |
3,538 |
|
Datasheet |
8400 | Tube | Active | PLCC | 20 (4 x 5) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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20-3518-10CONN IC DIP SOCKET 20POS GOLD |
511 |
|
Datasheet |
518 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
08-3518-11CONN IC DIP SOCKET 8POS GOLD |
225 |
|
Datasheet |
518 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
A-CCS 052-Z-TIC SOCKET PLCC 52POS TIN |
1,119 |
|
Datasheet |
- | Tube | Active | PLCC | 52 (4 x 13) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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110-41-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
810 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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D2899-42CONN IC DIP SOCKET 3POS GOLD |
773 |
|
Datasheet |
D2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 3 (1 x 3), 2 Loaded | Gold | Flash | Beryllium Copper | 0.200" (5.08mm) | Through Hole | Closed Frame | Solder | 0.200" (5.08mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
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8428-21B1-RK-TPCONN SOCKET PLCC 28POS TIN |
2,470 |
|
Datasheet |
8400 | Tube | Active | PLCC | 28 (4 x 7) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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8428-11B1-RK-TPCONN SOCKET PLCC 28POS TIN |
862 |
|
Datasheet |
8400 | Tube | Active | PLCC | 28 (4 x 7) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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110-44-624-41-001000CONN IC DIP SOCKET 24POS TIN |
2,598 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-44-324-41-001000CONN IC DIP SOCKET 24POS TIN |
900 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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SA286000CONN IC DIP SOCKET 28POS GOLD |
593 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Brass |
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D2820-42CONN IC DIP SOCKET 20POS GOLD |
8,261 |
|
Datasheet |
D2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Plastic | Brass |
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18-3518-10CONN IC DIP SOCKET 18POS GOLD |
391 |
|
Datasheet |
518 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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ICM-648-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 48P |
729 |
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Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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110-87-324-41-001101CONN IC DIP SOCKET 24POS GOLD |
1,421 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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8432-11B1-RK-TPCONN SOCKET PLCC 32POS TIN |
627 |
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Datasheet |
8400 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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AR 32-HZL/01-TTCONN IC DIP SOCKET 32POS GOLD |
1,868 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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PLCC-68-AT-SMTCONN SOCKET PLCC 68POS PHOS BRNZ |
1,421 |
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Datasheet |
PLCC | Tube | Active | PLCC | 68 (4 x 17) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 80.0µin (2.03µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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110-47-624-41-001000CONN IC DIP SOCKET 24POS GOLD |
291 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
