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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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D01-9970842CONN SOCKET SIP 8POS GOLD |
7,504 |
|
Datasheet |
D01-997 | Tube | Active | SIP | 8 (1 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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D01-9970742CONN SOCKET SIP 7POS GOLD |
4,149 |
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Datasheet |
D01-997 | Tube | Active | SIP | 7 (1 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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4828-6000-CPCONN IC DIP SOCKET 28POS TIN |
3,233 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -25°C ~ 85°C | 35.0µin (0.90µm) | Polyester, Glass Filled | Phosphor Bronze |
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4818-3004-CPCONN IC DIP SOCKET 18POS TIN |
6,102 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -25°C ~ 85°C | 35.0µin (0.90µm) | Polyester, Glass Filled | Phosphor Bronze |
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4824-3000-CPCONN IC DIP SOCKET 24POS TIN |
5,558 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -25°C ~ 85°C | 35.0µin (0.90µm) | Polyester, Glass Filled | Phosphor Bronze |
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SA183040CONN IC DIP SOCKET 18POS GOLD |
411 |
|
Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | 80.0µin (2.03µm) | Thermoplastic, Polyester, Glass Filled | Brass |
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AR 14-HZL/01-TTCONN IC DIP SOCKET 14POS GOLD |
9,397 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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110-99-314-41-001000CONN IC DIP SOCKET 14POS TINLEAD |
1,294 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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AR 06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD |
3,552 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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ICM-624-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 24P |
1,631 |
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Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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ICM-320-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 20P |
633 |
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Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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4828-3004-CPCONN IC DIP SOCKET 28POS TIN |
10,990 |
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Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -25°C ~ 85°C | 35.0µin (0.90µm) | Polyester, Glass Filled | Phosphor Bronze |
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D01-9971242CONN SOCKET SIP 12POS GOLD |
3,646 |
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Datasheet |
D01-997 | Tube | Active | SIP | 12 (1 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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1-2199299-540P,DIP SKT,600 CL,LDR,PB FREE |
2,339 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Nickel |
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XR2A-0811-NCONN IC DIP SOCKET 8POS GOLD |
331 |
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Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
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D01-9970942CONN SOCKET SIP 9POS GOLD |
5,876 |
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Datasheet |
D01-997 | Tube | Active | SIP | 9 (1 x 9) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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SA143040CONN IC DIP SOCKET 14POS GOLD |
4,785 |
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Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | 80.0µin (2.03µm) | Thermoplastic, Polyester, Glass Filled | Brass |
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4832-6000-CPCONN IC DIP SOCKET 32POS TIN |
2,433 |
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Datasheet |
4800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -25°C ~ 85°C | 35.0µin (0.90µm) | Polyester, Glass Filled | Phosphor Bronze |
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110-41-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
1,273 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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PLCC-20-ATPLCC 20P THROUGH HOLE |
3,380 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 20 (4 x 5) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 80.0µin (2.03µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
