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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICS-640-TIC SOCKET, DIP, 40P 2.54MM PITCH |
5,036 |
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Datasheet |
ICS | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ED16DTCONN IC DIP SOCKET 16POS TIN |
4,120 |
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Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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DILB24P-223TLFCONN IC DIP SOCKET 24POS TINLEAD |
6,814 |
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Datasheet |
DILB | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
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ED20DTCONN IC DIP SOCKET 20POS TIN |
15,136 |
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Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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243-20-1-03CONN IC DIP SOCKET 20POS TIN |
7,380 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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245-16-1-03CONN IC DIP SOCKET 16POS TIN |
5,485 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Kinked Pin | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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DILB14P-223TLFCONN IC DIP SOCKET 14POS TIN |
1,295 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
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D01-9970342CONN SOCKET SIP 3POS GOLD |
9,747 |
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Datasheet |
D01-997 | Tube | Active | SIP | 3 (1 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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110-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
6,785 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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A 24-LC-TTCONN IC DIP SOCKET 24POS TIN |
1,965 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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245-18-1-03CONN IC DIP SOCKET 18POS TIN |
1,776 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Kinked Pin | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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DILB20P-223TLFCONN IC DIP SOCKET 20POS TIN |
10,824 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
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DILB32P-223TLFCONN IC DIP SOCKET 32POS TINLEAD |
6,231 |
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Datasheet |
DILB | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
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SA083000CONN IC DIP SOCKET 8POS GOLD |
4,096 |
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Datasheet |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Brass |
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AR 06-HZL/01-TTCONN IC DIP SOCKET 6POS GOLD |
20,223 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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ICM-308-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 8P |
2,929 |
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Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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A 28-LC-TTCONN IC DIP SOCKET 28POS TIN |
1,565 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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A 20-LC-TTCONN IC DIP SOCKET 20POS TIN |
1,487 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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245-20-1-03CONN IC DIP SOCKET 20POS TIN |
1,216 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Kinked Pin | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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210-1-06-003CONN IC DIP SOCKET 6POS GOLD |
7,529 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
