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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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A-CCS 044-Z-TCONN SOCKET PLCC 44POS TIN |
7,055 |
|
Datasheet |
- | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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D01-9972042CONN SOCKET SIP 20POS GOLD |
8,730 |
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Datasheet |
D01-997 | Tube | Active | SIP | 20 (1 x 20) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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110-44-424-41-001000CONN IC DIP SOCKET 24POS TIN |
1,703 |
|
Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
940-44-032-17-400000CONN SOCKET PLCC 32POS TIN |
1,810 |
|
Datasheet |
940 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
10-3513-10CONN IC DIP SOCKET 10POS GOLD |
1,452 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
110-13-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
600 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
D2816-42CONN IC DIP SOCKET 16POS GOLD |
2,770 |
|
Datasheet |
D2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Plastic | Brass |
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214-44-314-01-670800CONN IC DIP SOCKET 14POS TIN |
9,045 |
|
Datasheet |
214 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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SA406000CONN IC DIP SOCKET 40POS GOLD |
1,417 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Brass |
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8432-21B1-RK-TPCONN SOCKET PLCC 32POS TIN |
2,433 |
|
Datasheet |
8400 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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08-3518-00CONN IC DIP SOCKET 8POS GOLD |
947 |
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Datasheet |
518 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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110-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
3,002 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
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110-93-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
2,715 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-44-328-41-001000CONN IC DIP SOCKET 28POS TIN |
1,520 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-44-628-41-001000CONN IC DIP SOCKET 28POS TIN |
1,002 |
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Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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940-44-044-17-400000CONN SOCKET PLCC 44POS TIN |
4,947 |
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Datasheet |
940 | Tube | Active | PLCC | 44 (4 x 11) | Tin | 150.0µin (3.81µm) | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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8444-11B1-RK-TPCONN SOCKET PLCC 44POS TIN |
1,492 |
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Datasheet |
8400 | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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8444-21B1-RK-TPCONN SOCKET PLCC 44POS TIN |
2,201 |
|
Datasheet |
8400 | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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A-CCS 068-Z-TCONN SOCKET PLCC 68POS TIN |
1,252 |
|
Datasheet |
- | Tube | Active | PLCC | 68 (4 x 17) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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917-43-103-41-005000CONN TRANSIST TO-5 3POS GOLD |
932 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-5 | 3 (Round) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
