| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-43-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
1,110 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
25-0513-10CONN SOCKET SIP 25POS GOLD |
304 |
|
Datasheet |
0513 | Bulk | Active | SIP | 25 (1 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
40-0518-10CONN SOCKET SIP 40POS GOLD |
2,062 |
|
Datasheet |
518 | Bulk | Active | SIP | 40 (1 x 40) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
110-43-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
984 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
110-93-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
653 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
110-13-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
1,430 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
40-6518-10CONN IC DIP SOCKET 40POS GOLD |
717 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
D01-9953242CONN SOCKET SIP 32POS GOLD |
1,247 |
|
Datasheet |
D01-995 | Bulk | Active | SIP | 32 (1 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
299-43-314-10-001000CONN IC DIP SOCKET 14POS GOLD |
367 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
TDU03DTONCONN SOCKET TRANSIST 3POS GOLD |
262 |
|
Datasheet |
- | Tray | Active | Transistor | 3 (Rectangular) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Board Guide | Solder | - | Gold | -55°C ~ 175°C | 30.0µin (0.76µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
TDU03DTODCONN SOCKET TRANSIST 3POS GOLD |
213 |
|
Datasheet |
- | Tray | Active | Transistor | 3 (Rectangular) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Board Guide, Flange | Solder | - | Gold | -55°C ~ 175°C | 30.0µin (0.76µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
714-43-164-31-018000CONN SOCKET SIP 64POS GOLD |
223 |
|
Datasheet |
714 | Tube | Active | SIP | 64 (1 x 64) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
28-6554-11CONN IC DIP SOCKET ZIF 28POS GLD |
145 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
214-3339-00-0602JCONN IC DIP SOCKET ZIF 14POS GLD |
312 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
224-1275-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
199 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
216-3340-00-0602JCONN IC DIP SOCKET ZIF 16POS GLD |
565 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
208-7391-55-1902CONN SOCKET SOIC 8POS GOLD |
298 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyethersulfone (PES), Glass Filled | Beryllium Copper |
|
248-1282-00-0602JCONN IC DIP SOCKET ZIF 48POS GLD |
614 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
216-7224-55-1902CONN SOCKET SOIC 16POS GOLD |
228 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 16 (2 x 8) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyethersulfone (PES), Glass Filled | Beryllium Copper |
|
203-2737-55-1102CONN TRANSIST TO-3/TO-66 3POS |
2,441 |
|
Datasheet |
Textool™ | Bulk | Active | Transistor, TO-3 and TO-66 | 3 (Rectangular) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | 0.234" (5.94mm) | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
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