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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICS-628-TIC SOCKET, DIP, 28P 2.54MM PITCH |
2,969 |
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Datasheet |
ICS | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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1-2199298-4CONN IC DIP SOCKET 16POS TIN |
3,880 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Brass, Copper |
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ED24DTCONN IC DIP SOCKET 24POS TIN |
7,688 |
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Datasheet |
ED | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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A 14-LC-TRCONN IC DIP SOCKET 14POS TIN |
3,787 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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ED08DTCONN IC DIP SOCKET 8POS TIN |
3,344 |
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Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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243-08-1-03CONN IC DIP SOCKET 8POS TIN |
9,404 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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243-06-1-03CONN IC DIP SOCKET 6POS TIN |
5,369 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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A 16-LC-TRCONN IC DIP SOCKET 16POS TIN |
3,935 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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ED18DTCONN IC DIP SOCKET 18POS TIN |
1,488 |
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Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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DILB18P-223TLFCONN IC DIP SOCKET 18POS TINLEAD |
10,058 |
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Datasheet |
DILB | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
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110-87-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
8,702 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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DILB16P-223TLFCONN IC DIP SOCKET 16POS TIN |
4,782 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
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A 18-LC-TTCONN IC DIP SOCKET 18POS TIN |
7,873 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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A 18-LC-TRCONN IC DIP SOCKET 18POS TIN |
3,037 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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243-14-1-03CONN IC DIP SOCKET 14POS TIN |
2,891 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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1-2199298-5CONN IC DIP SOCKET 18POS TIN |
2,498 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Brass, Copper |
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ED28DTCONN IC DIP SOCKET 28POS TIN |
7,399 |
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Datasheet |
ED | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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243-16-1-03CONN IC DIP SOCKET 16POS TIN |
4,330 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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245-14-1-03CONN IC DIP SOCKET 14POS TIN |
2,859 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Kinked Pin | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ED241DTCONN IC DIP SOCKET 24POS TIN |
2,669 |
|
Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
