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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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264-4493-00-0602JCONN IC DIP SOCKET ZIF 64POS GLD |
1,150 |
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Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
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225-PRS15001-12CONN SOCKET PGA ZIF GOLD |
2,465 |
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Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | 225 (15 x 15) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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289-PRS17001-12CONN SOCKET PGA ZIF GOLD |
1,755 |
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Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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240-5205-01CONN SOCKET QFN 40POS GOLD |
3,081 |
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Datasheet |
Textool™ | Bulk | Active | QFN | 40 (4 x 10) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | - | - | Polyethersulfone (PES) | Beryllium Copper |
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ICS-306-TIC SOCKET, DIP, 6P 2.54MM PITCH |
7,748 |
|
Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICS-308-TIC SOCKET, DIP, 8P 2.54MM PITCH |
10,424 |
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Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICS-314-TIC SOCKET, DIP, 14P 2.54MM PITCH |
2,629 |
|
Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICS-316-TIC SOCKET, DIP, 16P 2.54MM PITCH |
21,453 |
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Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICS-318-TIC SOCKET, DIP, 18P 2.54MM PITCH |
9,810 |
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Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ED14DTCONN IC DIP SOCKET 14POS TIN |
10,684 |
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Datasheet |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICS-320-TIC SOCKET, DIP, 20P 2.54MM PITCH |
9,010 |
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Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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A 08-LC-TRCONN IC DIP SOCKET 8POS TIN |
4,012 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
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AR 06-HZL-TTCONN IC DIP SOCKET 6POS TIN |
5,612 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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245-08-1-03CONN IC DIP SOCKET 8POS TIN |
3,915 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Kinked Pin | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICS-324-TIC SOCKET, DIP, 24P 2.54MM PITCH |
1,884 |
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Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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1-2199298-1CONN IC DIP SOCKET 6POS TIN |
6,487 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Brass, Copper |
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1-2199298-3CONN IC DIP SOCKET 14POS TIN |
8,658 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Brass, Copper |
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DILB8P-223TLFCONN IC DIP SOCKET 8POS TIN |
3,490 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 100.0µin (2.54µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyamide (PA), Nylon | Copper Alloy |
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ED40DTCONN IC DIP SOCKET 40POS TIN |
1,075 |
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Datasheet |
ED | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 110°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICS-328-TIC SOCKET, DIP, 28P 2.54MM PITCH |
3,016 |
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Datasheet |
ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
