IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
110-41-320-41-001000

110-41-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

525
110-41-320-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
115-93-318-41-003000

115-93-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2,514
115-93-318-41-003000

Datasheet

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
8452-21B1-RK-TP

8452-21B1-RK-TP

CONN SOCKET PLCC 52POS TIN

3M

1,883
8452-21B1-RK-TP

Datasheet

8400 Tube Active PLCC 52 (4 x 13) Tin 160.0µin (4.06µm) Copper Alloy 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin -40°C ~ 105°C 160.0µin (4.06µm) Polybutylene Terephthalate (PBT), Glass Filled Copper Alloy
4606

4606

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

888
4606

Datasheet

- Bulk Active Transistor, TO-3 3 (Rectangular) Tin - Brass - Chassis Mount Closed Frame Solder - Tin - - Polyester, Glass Filled Brass
114-87-328-41-134161

114-87-328-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,271
114-87-328-41-134161

Datasheet

114 Box Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
A-CCS 084-Z-T

A-CCS 084-Z-T

IC PLCC SOCKET 84POS TIN

Assmann WSW Components

649
A-CCS 084-Z-T

Datasheet

- Tube Active PLCC 84 (4 x 21) Tin 160.0µin (4.06µm) Phosphor Bronze 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 160.0µin (4.06µm) Polybutylene Terephthalate (PBT) Phosphor Bronze
123-87-316-41-001101

123-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

555
123-87-316-41-001101

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
54020-44030LF

54020-44030LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)

1,612
54020-44030LF

Datasheet

- Tube Active PLCC 44 (4 x 11) Tin 100.0µin (2.54µm) Copper Alloy 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 100.0µin (2.54µm) Polyphenylene Sulfide (PPS) Copper Alloy
917-43-104-41-001000

917-43-104-41-001000

CONN TRANSIST TO-5 4POS GOLD

Mill-Max Manufacturing Corp.

340
917-43-104-41-001000

Datasheet

917 Tube Active Transistor, TO-5 4 (Round) Gold 30.0µin (0.76µm) Beryllium Copper - Surface Mount Closed Frame Solder - Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
AR 20-HZW/TN

AR 20-HZW/TN

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

1,862
AR 20-HZW/TN

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -40°C ~ 105°C 200.0µin (5.08µm) Thermoplastic, Polyester Beryllium Copper
110-87-632-41-001101

110-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,879
110-87-632-41-001101

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SA486040

SA486040

CONN IC DIP SOCKET 48POS GOLD

On Shore Technology Inc.

106
SA486040

Datasheet

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 80.0µin (2.03µm) Thermoplastic, Polyester, Glass Filled Brass
110-93-318-41-001000

110-93-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

559
110-93-318-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-318-41-001000

110-43-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

291
110-43-318-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
4600

4600

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

596
4600

Datasheet

- Bulk Active Transistor, TO-3 3 (Oval) Tin - Brass - Chassis Mount Closed Frame Solder - Tin - - Polyester, Glass Filled Brass
110-93-320-41-001000

110-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

833
110-93-320-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-314-10-001000

110-43-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

209
110-43-314-10-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
214-44-320-01-670800

214-44-320-01-670800

CONN IC DIP SOCKET 20POS TIN

Mill-Max Manufacturing Corp.

324
214-44-320-01-670800

Datasheet

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
8468-21B1-RK-TP

8468-21B1-RK-TP

CONN SOCKET PLCC 68POS TIN

3M

2,073
8468-21B1-RK-TP

Datasheet

8400 Tube Active PLCC 68 (4 x 17) Tin 160.0µin (4.06µm) Copper Alloy 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin -40°C ~ 105°C 160.0µin (4.06µm) Polybutylene Terephthalate (PBT), Glass Filled Copper Alloy
8468-21A1-RK-TP

8468-21A1-RK-TP

CONN SOCKET PLCC 68POS TIN

3M

713
8468-21A1-RK-TP

Datasheet

8400 Tube Active PLCC 68 (4 x 17) Tin 160.0µin (4.06µm) Copper Alloy 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin -40°C ~ 105°C 160.0µin (4.06µm) Polybutylene Terephthalate (PBT), Glass Filled Copper Alloy
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