| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
14-6513-11CONN IC DIP SOCKET 14POS GOLD |
1,799 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
14-0513-11HCONN SOCKET SIP 14POS GOLD |
3,368 |
|
Datasheet |
0513 | Bulk | Active | SIP | 14 (1 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
24-6511-10CONN IC DIP SOCKET 24POS TIN |
2,446 |
|
Datasheet |
511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
16-3513-11HCONN IC DIP SOCKET 16POS GOLD |
1,123 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
ICO-322-MTT.100" LOW PROFILE SCREW MACHINE |
1,280 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
|
|
HLS-0114-TT-11.100" SCREW MACHINE SOCKET ARRAY |
2,032 |
|
Datasheet |
HLS | Tube | Active | SIP | 14 (1 x 14) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 140°C | - | Thermoplastic | - |
|
117-83-628-41-105101CONN IC DIP SOCKET 28POS GOLD |
1,318 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-420-41-011101CONN IC DIP SOCKET 20POS GOLD |
3,498 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
123-87-632-41-001101CONN IC DIP SOCKET 32POS GOLD |
4,534 |
|
Datasheet |
123 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
4733COVER PWR TRANS .140"ID TO-66 |
3,176 |
|
Datasheet |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
ICF-316-TL-I.100" SURFACE MOUNT SCREW MACHIN |
1,277 |
|
Datasheet |
ICF | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
|
|
ICA-316-ZWTT-3.100" SCREW MACHINE DIP SOCKET |
3,861 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
|
115-93-424-41-003000CONN IC DIP SOCKET 24POS GOLD |
2,473 |
|
Datasheet |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
28-6518-00CONN IC DIP SOCKET 28POS GOLD |
3,781 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
121-83-328-41-001101CONN IC DIP SOCKET 28POS GOLD |
2,488 |
|
Datasheet |
121 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0206-T-2.100" SCREW MACHINE SOCKET ARRAY |
4,096 |
|
Datasheet |
HLS | Tube | Active | SIP | 12 (2 x 6) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
10-9513-10CONN IC DIP SOCKET 10POS GOLD |
4,018 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
29-0518-10TCONN SOCKET SIP 29POS GOLD |
2,801 |
|
Datasheet |
518 | Bulk | Active | SIP | 29 (1 x 29) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
32-0518-10CONN SOCKET SIP 32POS GOLD |
4,954 |
|
Datasheet |
518 | Bulk | Active | SIP | 32 (1 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
32-1518-10CONN IC DIP SOCKET 32POS GOLD |
3,367 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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