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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
20-3513-11

20-3513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,156
20-3513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
110-83-950-41-001101

110-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

1,534
110-83-950-41-001101

Datasheet

110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
117-87-642-41-105101

117-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

1,202
117-87-642-41-105101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
21-0518-00

21-0518-00

CONN SOCKET SIP 21POS GOLD

Aries Electronics

4,409
21-0518-00

Datasheet

518 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
117-87-428-41-105101

117-87-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,440
117-87-428-41-105101

Datasheet

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
110-87-064-01-505101

110-87-064-01-505101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

4,974
110-87-064-01-505101

Datasheet

110 Bulk Active - 64 (2 x 32) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-83-632-41-003101

116-83-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,551
116-83-632-41-003101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
XR2A-1601-N

XR2A-1601-N

IC CONNECTOR

Omron Electronics Inc-EMC Div

1,835
XR2A-1601-N

Datasheet

* Bulk Active - - - - - - - - - - - - - - -
510-87-100-15-001101

510-87-100-15-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

1,520
510-87-100-15-001101

Datasheet

510 Bulk Active PGA 100 (15 x 15) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-87-100-15-101101

510-87-100-15-101101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

1,096
510-87-100-15-101101

Datasheet

510 Bulk Active PGA 100 (15 x 15) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-87-648-41-006101

116-87-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,920
116-87-648-41-006101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
916715-3

916715-3

CONN SOCKET PGA ZIF 321POS GOLD

TE Connectivity AMP Connectors

3,312
916715-3

Datasheet

- Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) Gold 15.0µin (0.38µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 15.0µin (0.38µm) Liquid Crystal Polymer (LCP) Phosphor Bronze
37-0518-10H

37-0518-10H

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3,800
37-0518-10H

Datasheet

518 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
HLS-0108-T-32

HLS-0108-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,064
HLS-0108-T-32

Datasheet

HLS Tube Active SIP 8 (1 x 8) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
16-3518-10H

16-3518-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,923
16-3518-10H

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
27-0518-10H

27-0518-10H

CONN SOCKET SIP 27POS GOLD

Aries Electronics

2,421
27-0518-10H

Datasheet

518 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
08-822-90T

08-822-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3,339
08-822-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
612-87-650-41-001101

612-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

4,432
612-87-650-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
ICA-314-WTT-2

ICA-314-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,141
ICA-314-WTT-2

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C - Polyester, Glass Filled Brass
3-1437536-4

3-1437536-4

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

1,411
3-1437536-4

Datasheet

500 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 25.0µin (0.63µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - - Brass
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