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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
510-83-066-11-002101

510-83-066-11-002101

CONN SOCKET PGA 66POS GOLD

Preci-Dip

2,805
510-83-066-11-002101

Datasheet

510 Bulk Active PGA 66 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
123-83-328-41-001101

123-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,072
123-83-328-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
2-1571586-5

2-1571586-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

3,943
2-1571586-5

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 25.0µin (0.63µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 25.0µin (0.63µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Copper
28-6518-11

28-6518-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,503
28-6518-11

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
AR32-HZW/T-R

AR32-HZW/T-R

CONN IC DIP SOCKET 32POS TIN

Assmann WSW Components

4,683
AR32-HZW/T-R

Datasheet

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 200.0µin (5.08µm) Thermoplastic, Polyester, Glass Filled Beryllium Copper
14-3501-20

14-3501-20

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,909
14-3501-20

Datasheet

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
14-3501-30

14-3501-30

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

4,494
14-3501-30

Datasheet

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7250-10

02-7250-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

1,745
02-7250-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7350-10

02-7350-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,245
02-7350-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7400-10

02-7400-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

4,989
02-7400-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7420-10

02-7420-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

1,212
02-7420-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7425-10

02-7425-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,091
02-7425-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7450-10

02-7450-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

1,822
02-7450-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7520-10

02-7520-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

1,835
02-7520-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7540-10

02-7540-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,710
02-7540-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7625-10

02-7625-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

3,046
02-7625-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
02-7920-10

02-7920-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,100
02-7920-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
116-83-636-41-018101

116-83-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

4,362
116-83-636-41-018101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
32-0518-10T

32-0518-10T

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,511
32-0518-10T

Datasheet

518 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
116-83-328-41-008101

116-83-328-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,470
116-83-328-41-008101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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