| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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|
346-43-112-41-013000CONN SOCKET SIP 12POS GOLD |
2,532 |
|
Datasheet |
346 | Bulk | Active | SIP | 12 (1 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
212-1-28-006CONN IC DIP SOCKET 28POS GOLD |
4,155 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
|
|
HLS-0112-S-22.100" SCREW MACHINE SOCKET ARRAY |
4,178 |
|
Datasheet |
HLS | Tube | Active | SIP | 12 (1 x 12) | Gold | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
34-3513-10TCONN IC DIP SOCKET 34POS GOLD |
3,427 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 34 (2 x 17) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
614-83-636-31-012101CONN IC DIP SOCKET 36POS GOLD |
3,603 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
03-0511-10CONN SOCKET SIP 3POS TIN |
2,733 |
|
Datasheet |
511 | Bulk | Active | SIP | 3 (1 x 3) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 50.0µin (1.27µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
30-6513-10CONN IC DIP SOCKET 30POS GOLD |
1,858 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
06-820-90CCONN IC DIP SOCKET 6POS GOLD |
4,092 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
06-822-90CCONN IC DIP SOCKET 6POS GOLD |
1,884 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
06-823-90CCONN IC DIP SOCKET 6POS GOLD |
4,144 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
122-83-428-41-001101CONN IC DIP SOCKET 28POS GOLD |
2,068 |
|
Datasheet |
122 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-422-41-004101CONN IC DIP SOCKET 22POS GOLD |
4,911 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
ICA-316-WTT-3.100" SCREW MACHINE DIP SOCKET |
1,352 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
|
|
1-1437540-0CONN IC DIP SOCKET 36POS GOLD |
3,025 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | - |
|
|
ICA-308-WGT-2.100" SCREW MACHINE DIP SOCKET |
2,070 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
|
115-83-650-41-001101CONN IC DIP SOCKET 50POS GOLD |
4,274 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0206-T-10.100" SCREW MACHINE SOCKET ARRAY |
2,161 |
|
Datasheet |
HLS | Tube | Active | SIP | 12 (2 x 6) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
116-87-632-41-002101CONN IC DIP SOCKET 32POS GOLD |
4,983 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
30-6511-10CONN IC DIP SOCKET 30POS TIN |
1,434 |
|
Datasheet |
511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
02-7400-11CONN SOCKET SIP 2POS GOLD |
3,222 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
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