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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-1908-T-T

APH-1908-T-T

APH-1908-T-T

Samtec Inc.

2,785
APH-1908-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0208-T-T

APH-0208-T-T

APH-0208-T-T

Samtec Inc.

2,397
APH-0208-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0708-T-T

APH-0708-T-T

APH-0708-T-T

Samtec Inc.

2,631
APH-0708-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1808-T-T

APH-1808-T-T

APH-1808-T-T

Samtec Inc.

4,965
APH-1808-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1708-T-T

APH-1708-T-T

APH-1708-T-T

Samtec Inc.

3,934
APH-1708-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0408-T-T

APH-0408-T-T

APH-0408-T-T

Samtec Inc.

3,773
APH-0408-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0908-T-T

APH-0908-T-T

APH-0908-T-T

Samtec Inc.

2,064
APH-0908-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0808-T-T

APH-0808-T-T

APH-0808-T-T

Samtec Inc.

2,003
APH-0808-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1308-T-T

APH-1308-T-T

APH-1308-T-T

Samtec Inc.

2,824
APH-1308-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
XR2A-2025

XR2A-2025

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div

3,112
XR2A-2025

Datasheet

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C Flash Polybutylene Terephthalate (PBT), Glass Filled Beryllium Copper
18-6513-10H

18-6513-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,089
18-6513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
20-9513-11

20-9513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,109
20-9513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
08-2822-90

08-2822-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,280
08-2822-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
08-2823-90

08-2823-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,070
08-2823-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
08-820-90

08-820-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

4,513
08-820-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
08-822-90

08-822-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,355
08-822-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
17-0517-90C

17-0517-90C

CONN SOCKET SIP 17POS GOLD

Aries Electronics

1,237
17-0517-90C

Datasheet

0517 Bulk Active SIP 17 (1 x 17) Gold 30.0µin (0.76µm) Beryllium Copper - Through Hole, Right Angle - Solder - Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICO-314-NGT

ICO-314-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,121
ICO-314-NGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
510-87-168-17-001101

510-87-168-17-001101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

1,893
510-87-168-17-001101

Datasheet

510 Bulk Active PGA 168 (17 x 17) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-87-168-17-101101

510-87-168-17-101101

CONN SOCKET PGA 168POS GOLD

Preci-Dip

2,104
510-87-168-17-101101

Datasheet

510 Bulk Active PGA 168 (17 x 17) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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