| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
30-0518-00CONN SOCKET SIP 30POS GOLD |
4,428 |
|
Datasheet |
518 | Bulk | Active | SIP | 30 (1 x 30) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
30-1518-00CONN IC DIP SOCKET 30POS GOLD |
4,648 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 30 (2 x 15) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
08-81250-610CCONN IC DIP SOCKET 8POS GOLD |
4,959 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
08-8305-610CCONN IC DIP SOCKET 8POS GOLD |
1,849 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
116-87-650-41-009101CONN IC DIP SOCKET 50POS GOLD |
1,370 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-87-169-17-101101CONN SOCKET PGA 169POS GOLD |
4,301 |
|
Datasheet |
510 | Bulk | Active | PGA | 169 (17 x 17) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-636-41-001101CONN IC DIP SOCKET 36POS GOLD |
4,397 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
ICA-314-ZWGT-3.100" SCREW MACHINE DIP SOCKET |
4,084 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
|
|
HLS-0405-S-2.100" SCREW MACHINE SOCKET ARRAY |
2,228 |
|
Datasheet |
HLS | Bulk | Active | SIP | 20 (4 x 5) | Gold | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
28-6518-10MCONN IC DIP SOCKET 28POS GOLD |
1,889 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
08-71000-10CONN SOCKET SIP 8POS TIN |
1,760 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-71250-10CONN SOCKET SIP 8POS TIN |
2,136 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7350-10CONN SOCKET SIP 8POS TIN |
4,398 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7350-11CONN SOCKET SIP 8POS GOLD |
2,585 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7360-10CONN SOCKET SIP 8POS TIN |
2,728 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7390-10CONN SOCKET SIP 8POS TIN |
4,889 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7400-10CONN SOCKET SIP 8POS TIN |
3,260 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7425-10CONN SOCKET SIP 8POS TIN |
4,633 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7430-10CONN SOCKET SIP 8POS TIN |
4,384 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-7445-10CONN SOCKET SIP 8POS TIN |
3,025 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
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