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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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110-83-316-10-003101CONN IC DIP SOCKET 16POS GOLD |
2,664 |
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Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8), 8 Loaded | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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2445893-3DIP IC SOCKET 20P SMT |
3,000 |
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Datasheet |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | Tin | 196.9µin (5.00µm) | Copper Alloy | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 78.7µin (2.00µm) | Thermoplastic | Copper Alloy |
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D2608-42CONN IC DIP SOCKET 8POS GOLD |
2,312 |
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Datasheet |
D26 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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2485264-4DIP IC SOCKET 18P,GOLD FLASH |
5,280 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | Gold | Flash | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 78.7µin (2.00µm) | Thermoplastic | Copper Alloy |
|
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2445893-2DIP IC SOCKET 16P SMT |
3,000 |
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Datasheet |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | Tin | 196.9µin (5.00µm) | Copper Alloy | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 78.7µin (2.00µm) | Thermoplastic | Copper Alloy |
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ICO-308-STTCONN IC DIP SOCKET 8POS TIN |
111 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
|
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2485264-7DIP IC SOCKET 28P,GOLD FLASH |
3,822 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 | Gold | Flash | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 78.7µin (2.00µm) | Thermoplastic | Copper Alloy |
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116-83-314-41-006101CONN IC DIP SOCKET 14POS GOLD |
2,396 |
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Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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SMPX-52LCC-PSMT PLCC SOCKET 52P POLARISED RO |
203 |
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Datasheet |
SMPX | Tube | Active | PLCC | 52 (4 x 13) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | -50°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
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146-43-308-41-013000CONN IC DIP SOCKET 8POS GOLD |
120 |
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Datasheet |
146 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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115-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
237 |
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Datasheet |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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110-83-624-41-001101CONN IC DIP SOCKET 24POS GOLD |
1,016 |
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Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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940-44-032-17-400004CONN SOCKET PLCC 32POS SMD |
390 |
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Datasheet |
940 | Tape & Reel (TR) | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | - | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | - |
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ICO-314-MTT.100" LOW PROFILE SCREW MACHINE |
2,798 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
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8452-21B1-RK-TRCONN SOCKET PLCC 52POS TIN |
1,857 |
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Datasheet |
8400 | Tape & Reel (TR) | Active | PLCC | 52 (4 x 13) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
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4602CONN TRANSIST TO-3 3POS TIN |
1,759 |
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Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Oval) | Tin | - | Brass | - | Chassis Mount | Closed Frame | Solder | - | Tin | - | - | Polyester, Glass Filled | Brass |
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2485265-1DIP IC SOCKET 40P,GOLD FLASH |
1,950 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | Gold | Flash | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 78.7µin (2.00µm) | Thermoplastic | Copper Alloy |
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540-44-032-17-400004CONN SKT PLCC |
800 |
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Datasheet |
540 | Tape & Reel (TR) | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 100.0µin (2.54µm) | - | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | - |
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123-83-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
1,058 |
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Datasheet |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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110-93-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
183 |
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Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
