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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICA-640-SGTCONN IC DIP SOCKET 40POS GOLD |
2,843 |
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Datasheet |
ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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115-93-306-41-001000CONN IC DIP SOCKET 6POS GOLD |
133 |
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Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-93-310-41-105000CONN IC DIP SOCKET 10POS GOLD |
1,148 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-43-210-41-105000CONN IC SKT DBL |
154 |
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Datasheet |
110 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-43-314-41-105000CONN IC SKT DBL |
161 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | - | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-43-316-41-105000SOCKET IC .300 16POS SMD |
173 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | - | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-13-310-41-001000CONN IC DIP SOCKET 10POS GOLD |
956 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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210-13-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
1,135 |
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Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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299-43-324-11-001000CONN IC DIP SOCKET 24POS GOLD |
176 |
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Datasheet |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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1-2397198-1SOCKET 4710 FOR ODM |
3,512 |
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Datasheet |
- | Tray | Active | LGA | 4710 | Gold | 30.0µin (0.76µm) | Copper Alloy | 0.031" (0.80mm) | Surface Mount | - | Solder | 0.031" (0.80mm) | Tin | -40°C ~ 100°C | - | Thermoplastic | Copper Alloy |
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1674770-7HARD TRAY ASSY MPGA479M W/TAPE |
6,240 |
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Datasheet |
- | Bulk | Active | PGA, ZIF (ZIP) | 479 (26 x 26) | Gold | 30.0µin (0.76µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | - | 30.0µin (0.76µm) | Thermoplastic | Copper Alloy |
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1-390263-1CONN IC DIP SOCKET 28POS TIN |
1,199 |
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Datasheet |
- | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | - | Phosphor Bronze |
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2-641296-4CONN IC DIP SOCKET 6POS GOLD |
2,459 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
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2-382462-3CONN IC DIP SOCKET 8POS TIN |
3,696 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic | Phosphor Bronze |
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1-390262-1CONN IC DIP SOCKET 24POS TIN |
2,107 |
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Datasheet |
- | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | - | Phosphor Bronze |
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2-382568-0CONN IC DIP SOCKET 20POS TIN |
2,445 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
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02-0518-10CONN SOCKET SIP 2POS GOLD |
12,441 |
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Datasheet |
518 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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2-382465-3CONN IC DIP SOCKET 20POS TIN |
4,905 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic | Phosphor Bronze |
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346-43-101-41-013000CONN SOCKET SIP 1POS GOLD |
1,753 |
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Datasheet |
346 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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211-1-06-003CONN IC DIP SOCKET 6POS GOLD |
7,352 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
