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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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714-43-104-31-018000CONN SOCKET SIP 4POS GOLD |
1,096 |
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Datasheet |
714 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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4-1571551-3CONN IC DIP SOCKET 14POS GOLD |
4,022 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Nickel |
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211-1-24-006CONN IC DIP SOCKET 24POS GOLD |
785 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
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4-1571552-5CONN IC DIP SOCKET 18POS GOLD |
2,244 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 20.0µin (0.51µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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2-1437531-0CONN IC DIP SOCKET 14POS GOLD |
2,155 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | - | - | Copper Alloy |
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7-1437529-97-1437529-9 |
1,462 |
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Datasheet |
500 | Box | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polyester | Copper Alloy |
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2-641615-2CONN IC DIP SOCKET 28POS GOLD |
535 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic, Glass Filled | Beryllium Copper |
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1437540-5CONN IC DIP SOCKET 32POS TINLEAD |
3,042 |
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Datasheet |
800 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | - |
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211-1-28-006CONN IC DIP SOCKET 28POS GOLD |
281 |
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Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
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346-93-106-41-013000CONN SOCKET SIP 6POS GOLD |
162 |
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Datasheet |
346 | Tube | Active | SIP | 6 (1 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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APA-308-T-A1ADAPTER PLUG |
3,745 |
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Datasheet |
APA | Bulk | Active | - | 8 (2 x 4) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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115-47-318-41-003000CONN IC DIP SOCKET 18POS GOLD |
182 |
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Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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816-AG12D-ES-LFCONN IC DIP SOCKET 16POS TIN |
4,600 |
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Datasheet |
800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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50951-0084N-0011.27MM SPI ROM SOCKET CONN SMT S |
955 |
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Datasheet |
50951 | Cut Tape (CT) | Active | SIP | 8 | Tin | 80.0µin (2.03µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | - | 80.0µin (2.03µm) | Thermoplastic | Copper Alloy |
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50960-0084N-0011.27MM PITCH SPI FLASH SOCKET CO |
689 |
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Datasheet |
50960 | Cut Tape (CT) | Active | SIP | 8 | Tin | 100.0µin (2.54µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | - | 100.0µin (2.54µm) | Thermoplastic | Copper Alloy |
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91960-0084N8P, 1.27MM PSI FLASH SOCKET, SMT |
677 |
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Datasheet |
91960 | Cut Tape (CT) | Active | DIP, ZIF (ZIP) | 8 | Tin | 50.0µin (1.27µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | - | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 85°C | 50.0µin (1.27µm) | Thermoplastic | Copper Alloy |
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AR 16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD |
1,391 |
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Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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1814640-8CONN IC DIP SOCKET 8POS TIN |
2,766 |
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Datasheet |
- | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Brass |
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5-1571552-6CONN IC DIP SOCKET 24POS GOLD |
3,028 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 20.0µin (0.51µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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824-AG11D-ESL-LFCONN IC DIP SOCKET 24POS GOLD |
1,845 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
