| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICA-314-WGG-2.100" SCREW MACHINE DIP SOCKET |
3,679 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
|
40-3513-10CONN IC DIP SOCKET 40POS GOLD |
3,920 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
510-83-114-13-001101CONN SOCKET PGA 114POS GOLD |
3,566 |
|
Datasheet |
510 | Bulk | Active | PGA | 114 (13 x 13) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-83-114-13-062101CONN SOCKET PGA 114POS GOLD |
1,067 |
|
Datasheet |
510 | Bulk | Active | PGA | 114 (13 x 13) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-83-652-41-035101CONN IC DIP SOCKET 52POS GOLD |
1,637 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-83-652-41-036101CONN IC DIP SOCKET 52POS GOLD |
3,987 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0310-T-2.100" SCREW MACHINE SOCKET ARRAY |
2,022 |
|
Datasheet |
HLS | Tube | Active | SIP | 30 (3 x 10) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
550-10-037-10-061101PGA SOLDER TAIL |
1,152 |
|
Datasheet |
550 | Bulk | Active | PGA | 37 (10 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
ICO-316-MGG.100" LOW PROFILE SCREW MACHINE |
2,693 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
|
XR2C-2002CONN SOCKET SIP 20POS GOLD |
1,011 |
|
Datasheet |
XR2 | Bulk | Obsolete | SIP | 20 (1 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
|
|
50-9513-10CONN IC DIP SOCKET 50POS GOLD |
3,975 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
21-0517-90CCONN SOCKET SIP 21POS GOLD |
3,842 |
|
Datasheet |
0517 | Bulk | Active | SIP | 21 (1 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole, Right Angle | - | Solder | - | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
28-6513-10HCONN IC DIP SOCKET 28POS GOLD |
2,288 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
32-9513-10CONN IC DIP SOCKET 32POS GOLD |
2,914 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
24-4518-10HCONN IC DIP SOCKET 24POS GOLD |
2,707 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
ICO-318-NGT.100" LOW PROFILE SCREW MACHINE |
3,793 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
|
|
126-41-304-41-001000CONN IC SKT DBL |
1,844 |
|
Datasheet |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
126-91-304-41-001000CONN IC SKT DBL |
4,842 |
|
Datasheet |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
PGA145H003B1-1521RPGA SOCKET 145 CTS |
1,680 |
|
Datasheet |
- | - | Active | PGA | 145 (15 x 15) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | - | - | - | - | - | - |
|
|
ICF-648-T-O.100" SURFACE MOUNT SCREW MACHIN |
4,874 |
|
Datasheet |
ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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