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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
22-6501-20

22-6501-20

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

2,332
22-6501-20

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
22-6501-30

22-6501-30

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

4,036
22-6501-30

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
09-0501-20

09-0501-20

CONN SOCKET SIP 9POS TIN

Aries Electronics

4,184
09-0501-20

Datasheet

501 Bulk Active SIP 9 (1 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
33-0511-10

33-0511-10

CONN SOCKET SIP 33POS TIN

Aries Electronics

3,815
33-0511-10

Datasheet

511 Bulk Active SIP 33 (1 x 33) Tin 50.0µin (1.27µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 50.0µin (1.27µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
824-AG30D

824-AG30D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

1,521
824-AG30D

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) - -55°C ~ 105°C - Polyester -
14-823-90C

14-823-90C

IC SOCKET 14PIN VERT SCKT HORIZ

Aries Electronics

3,161
14-823-90C

Datasheet

Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-3518-01

16-3518-01

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,242
16-3518-01

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-6823-90T

16-6823-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

4,727
16-6823-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
16-822-90T

16-822-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,908
16-822-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
14-4820-90C

14-4820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,362
14-4820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
14-4823-90C

14-4823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,087
14-4823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
14-6820-90C

14-6820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,347
14-6820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
14-6822-90C

14-6822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,477
14-6822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
14-6823-90C

14-6823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,342
14-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
14-820-90C

14-820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,280
14-820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
14-822-90C

14-822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,376
14-822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICA-422-WGT-2

ICA-422-WGT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,041
ICA-422-WGT-2

Datasheet

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
32-1518-11H

32-1518-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,075
32-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICF-640-TM-O

ICF-640-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,254
ICF-640-TM-O

Datasheet

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
HLS-0120-T-11

HLS-0120-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,046
HLS-0120-T-11

Datasheet

HLS Tube Active SIP 20 (1 x 20) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
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