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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-1122-T-H

APH-1122-T-H

APH-1122-T-H

Samtec Inc.

3,184
APH-1122-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0222-T-H

APH-0222-T-H

APH-0222-T-H

Samtec Inc.

4,883
APH-0222-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1722-T-H

APH-1722-T-H

APH-1722-T-H

Samtec Inc.

1,863
APH-1722-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1222-T-H

APH-1222-T-H

APH-1222-T-H

Samtec Inc.

1,669
APH-1222-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1622-T-H

APH-1622-T-H

APH-1622-T-H

Samtec Inc.

1,754
APH-1622-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0722-T-H

APH-0722-T-H

APH-0722-T-H

Samtec Inc.

2,764
APH-0722-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0322-T-H

APH-0322-T-H

APH-0322-T-H

Samtec Inc.

3,560
APH-0322-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1322-T-H

APH-1322-T-H

APH-1322-T-H

Samtec Inc.

4,509
APH-1322-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0822-T-H

APH-0822-T-H

APH-0822-T-H

Samtec Inc.

2,866
APH-0822-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
ICO-632-ZCGT

ICO-632-ZCGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,802
ICO-632-ZCGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
28-6511-11

28-6511-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,415
28-6511-11

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
116-47-308-41-006000

116-47-308-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,666
116-47-308-41-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-41-306-41-008000

116-41-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,088
116-41-306-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-306-41-008000

116-91-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,442
116-91-306-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0211-G-11

HLS-0211-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,947
HLS-0211-G-11

Datasheet

HLS Tube Active SIP 22 (2 x 11) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
828-AG12D

828-AG12D

CONN IC DIP SOCKET 28POS TINLEAD

TE Connectivity AMP Connectors

4,407
828-AG12D

Datasheet

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin-Lead - Copper Alloy 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 105°C - Polyester Copper Alloy
24-3503-30

24-3503-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,197
24-3503-30

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
22-0503-20

22-0503-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,765
22-0503-20

Datasheet

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA), Nylon, Glass Filled Brass
22-0503-30

22-0503-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2,235
22-0503-30

Datasheet

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA), Nylon, Glass Filled Brass
317-91-106-41-005000

317-91-106-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

2,881
317-91-106-41-005000

Datasheet

317 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper 0.070" (1.78mm) Through Hole - Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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