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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
16-3503-31

16-3503-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,749
16-3503-31

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
30-3503-20

30-3503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,742
30-3503-20

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
30-3503-30

30-3503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

1,464
30-3503-30

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
210-11-310-41-001000

210-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,095
210-11-310-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-93-306-41-007000

116-93-306-41-007000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

2,085
116-93-306-41-007000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-306-41-007000

116-43-306-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,138
116-43-306-41-007000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0317-T-2

HLS-0317-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,435
HLS-0317-T-2

Datasheet

HLS Tube Active SIP 51 (3 x 17) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
546-83-085-11-002135

546-83-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip

1,764
546-83-085-11-002135

Datasheet

546 Bulk Active PGA 85 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
546-83-085-11-002136

546-83-085-11-002136

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,513
546-83-085-11-002136

Datasheet

546 Bulk Active PGA 85 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
20-810-90TWR

20-810-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3,273
20-810-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
146-41-308-41-012000

146-41-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

4,827
146-41-308-41-012000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
146-91-308-41-012000

146-91-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

1,315
146-91-308-41-012000

Datasheet

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
104-13-306-41-770000

104-13-306-41-770000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3,097
104-13-306-41-770000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Thermoplastic Brass Alloy
110-43-210-41-001000

110-43-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,540
110-43-210-41-001000

Datasheet

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICA-320-ZWGG-2

ICA-320-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,409
ICA-320-ZWGG-2

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
ICF-328-STL-I

ICF-328-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

3,425
ICF-328-STL-I

Datasheet

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
ICF-628-STL-O

ICF-628-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

4,900
ICF-628-STL-O

Datasheet

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
ICF-648-TL-O

ICF-648-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,227
ICF-648-TL-O

Datasheet

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
APH-0918-T-T

APH-0918-T-T

APH-0918-T-T

Samtec Inc.

2,433
APH-0918-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1018-T-T

APH-1018-T-T

APH-1018-T-T

Samtec Inc.

3,485
APH-1018-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
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