| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APH-1718-T-TAPH-1718-T-T |
1,128 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0718-T-TAPH-0718-T-T |
2,183 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0318-T-TAPH-0318-T-T |
2,531 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
116-41-308-41-006000CONN IC SKT DBL |
1,106 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-308-41-006000CONN IC SKT DBL |
4,940 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
917-41-103-41-005000CONN SKT TRANSISTOR |
4,382 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-5 | 3 (Round) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
917-91-103-41-005000CONN SKT TRANSISTOR |
2,089 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-5 | 3 (Round) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
116-83-642-41-013101CONN IC DIP SOCKET 42POS GOLD |
4,299 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
30-9513-10HCONN IC DIP SOCKET 30POS GOLD |
2,231 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 30 (2 x 15) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
110-99-322-41-001000CONN IC DIP SOCKET 22POS TINLEAD |
1,258 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-44-322-41-001000CONN IC SKT DBL |
2,596 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-44-422-41-001000CONN IC SKT DBL |
4,208 |
|
Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
917-41-103-41-001000CONN SKT TRANSISTOR |
4,251 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-5 | 3 (Round) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
210-11-308-41-001000CONN IC SKT DBL |
3,634 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
HLS-0313-T-10.100" SCREW MACHINE SOCKET ARRAY |
4,415 |
|
Datasheet |
HLS | Tube | Active | SIP | 39 (3 x 13) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
20-3508-30CONN IC DIP SOCKET 20POS GOLD |
2,176 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
16-8450-610CCONN IC DIP SOCKET 16POS GOLD |
4,633 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
16-8500-610CCONN IC DIP SOCKET 16POS GOLD |
3,638 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
HLS-0410-T-2.100" SCREW MACHINE SOCKET ARRAY |
3,293 |
|
Datasheet |
HLS | Bulk | Active | SIP | 40 (4 x 10) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
210-99-324-41-001000CONN IC DIP SOCKET 24POS TINLEAD |
4,549 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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