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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
116-41-316-41-006000

116-41-316-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,054
116-41-316-41-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-316-41-006000

116-91-316-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,221
116-91-316-41-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-322-41-001000

110-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,944
110-43-322-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
124-41-306-41-002000

124-41-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,059
124-41-306-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
124-91-306-41-002000

124-91-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,465
124-91-306-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
410-91-220-10-001000

410-91-220-10-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,145
410-91-220-10-001000

Datasheet

410 Tube Active Zig-Zag, Left Stackable 20 (2 x 10) - - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
410-91-220-10-002000

410-91-220-10-002000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,333
410-91-220-10-002000

Datasheet

410 Tube Active Zig-Zag, Right Stackable 20 (2 x 10) - - Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-93-308-41-001000

116-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,230
116-93-308-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-308-41-001000

116-43-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,153
116-43-308-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
32-6556-10

32-6556-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,075
32-6556-10

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
115-44-632-41-003000

115-44-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,916
115-44-632-41-003000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-93-310-41-001000

614-93-310-41-001000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.

3,356
614-93-310-41-001000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-43-310-41-001000

614-43-310-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,034
614-43-310-41-001000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0220-T-22-L

HLS-0220-T-22-L

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,101
HLS-0220-T-22-L

Datasheet

HLS Tube Active SIP 40 (2 x 20) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
HLS-0120-G-12

HLS-0120-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,402
HLS-0120-G-12

Datasheet

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
315-93-120-41-003000

315-93-120-41-003000

SOCKET LOW PROFILE SIP 20POS

Mill-Max Manufacturing Corp.

1,707
315-93-120-41-003000

Datasheet

315 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
34-3503-20

34-3503-20

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

2,331
34-3503-20

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
34-3503-30

34-3503-30

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

1,534
34-3503-30

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
110-47-632-41-605000

110-47-632-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,677
110-47-632-41-605000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
345444-4

345444-4

CONN SOCKET PGA 168POS GOLD

TE Connectivity AMP Connectors

4,783
345444-4

Datasheet

- Tube Obsolete PGA 168 (17 x 17) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead - 3.00µin (0.076µm) Thermoplastic, Polyester Beryllium Copper
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