| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
410-91-214-10-001000STANDRD SOLDRTL DBL SKT |
2,832 |
|
Datasheet |
410 | Tube | Active | Zig-Zag, Left Stackable | 14 (2 x 7) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
104-11-314-41-770000CONN IC SKT DBL |
2,958 |
|
Datasheet |
104 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
110-93-422-41-801000CONN IC DIP SOCKET 22POS GOLD |
1,298 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
28-6570-10CONN IC DIP SOCKET ZIF 28POS TIN |
4,616 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
115-91-632-41-003000SOCKET IC OPEN LOWPRO .600 32POS |
2,186 |
|
Datasheet |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Thermoplastic | Brass Alloy |
|
|
115-41-632-41-003000CONN IC SKT DBL |
4,084 |
|
Datasheet |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
8-1437504-5CONN TRANSIST TO-3 3POS TIN |
4,860 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin | - | Beryllium Copper | - | Chassis Mount | Closed Frame | Solder | - | Tin | -55°C ~ 125°C | - | Polytetrafluoroethylene (PTFE) | Beryllium Copper |
|
|
114-47-432-41-117000STANDRD SOLDRTL DBL SKT |
3,049 |
|
Datasheet |
114 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
114-47-632-41-117000STANDRD SOLDRTL DBL SKT |
3,668 |
|
Datasheet |
114 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
115-44-428-41-003000CONN IC SKT DBL |
4,190 |
|
Datasheet |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
111-93-322-41-001000CONN IC DIP SOCKET 22POS GOLD |
4,947 |
|
Datasheet |
111 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
111-93-422-41-001000CONN IC DIP SOCKET 22POS GOLD |
3,167 |
|
Datasheet |
111 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
111-43-322-41-001000CONN IC SKT DBL |
3,995 |
|
Datasheet |
111 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
111-43-422-41-001000CONN IC SKT DBL |
1,475 |
|
Datasheet |
111 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
APO-632-G-A1.100" LOW PROFILE SCREW MACHINE |
2,388 |
|
Datasheet |
APO | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
614-41-314-31-012000SKT CARRIER PGA |
2,517 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
614-91-314-31-012000SKT CARRIER PGA |
4,420 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
ICA-324-WGG.100" SCREW MACHINE DIP SOCKET |
1,550 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
110-93-422-41-105000CONN IC DIP SOCKET 22POS GOLD |
1,493 |
|
Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-43-322-41-105000CONN IC SKT DBL |
1,813 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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