| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
317-43-114-41-005000CONN SKT STRIP |
4,323 |
|
Datasheet |
317 | Bulk | Active | SIP | 14 (1 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | - | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
123-11-308-41-001000CONN IC SKT DBL |
3,306 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-41-324-41-006000CONN IC SKT DBL |
2,562 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-41-424-41-006000CONN IC SKT DBL |
1,892 |
|
Datasheet |
116 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-41-624-41-006000CONN IC SKT DBL |
4,773 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-324-41-006000CONN IC SKT DBL |
1,192 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-424-41-006000CONN IC SKT DBL |
2,642 |
|
Datasheet |
116 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-624-41-006000CONN IC SKT DBL |
4,635 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
123-91-314-41-001000SOCKET IC OPEN 3 LVL .300 14POS |
2,246 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
123-41-314-41-001000CONN IC SKT DBL |
4,329 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
APA-314-G-CADAPTER PLUG |
1,906 |
|
Datasheet |
APA | Bulk | Active | - | 14 (2 x 7) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 20.0µin (0.51µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
146-41-422-41-012000CONN SKT DBL |
3,543 |
|
Datasheet |
146 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
146-91-422-41-012000CONN SKT DBL |
3,000 |
|
Datasheet |
146 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-41-328-41-105000CONN IC SKT DBL |
3,370 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-41-428-41-105000CONN IC SKT DBL |
2,850 |
|
Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-41-628-41-105000CONN IC SKT DBL |
3,141 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-91-328-41-105000CONN IC SKT DBL |
2,157 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-91-428-41-105000CONN IC SKT DBL |
4,363 |
|
Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-91-628-41-105000CONN IC SKT DBL |
2,344 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-47-650-41-001000STANDRD SOLDRTL |
1,630 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
Upload
