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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
12-6810-90C

12-6810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

1,271
12-6810-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
APA-640-T-B

APA-640-T-B

ADAPTER PLUG

Samtec Inc.

100
APA-640-T-B

Datasheet

APA Bulk Active - 40 (2 x 20) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
APA-640-G-A1

APA-640-G-A1

ADAPTER PLUG

Samtec Inc.

3,198
APA-640-G-A1

Datasheet

APA Bulk Active - 40 (2 x 20) Gold 20.0µin (0.51µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 20.0µin (0.51µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
28-823-90C

28-823-90C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,565
28-823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
299-93-628-10-002000

299-93-628-10-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

4,202
299-93-628-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-13-640-41-801000

110-13-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,615
110-13-640-41-801000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APA-316-G-P

APA-316-G-P

ADAPTER PLUG

Samtec Inc.

1,418
APA-316-G-P

Datasheet

APA Tube Active - 16 (2 x 8) Gold 20.0µin (0.51µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 20.0µin (0.51µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
40-516-11

40-516-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

4,554
40-516-11

Datasheet

516 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Beryllium Copper
110-13-324-41-801000

110-13-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,720
110-13-324-41-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
209-PGM17020-10

209-PGM17020-10

CONN SOCKET PGA GOLD

Aries Electronics

1,192
209-PGM17020-10

Datasheet

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
2-2129710-8

2-2129710-8

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

1,459
2-2129710-8

Datasheet

- Tray Active LGA 3647 Gold 30.0µin (0.76µm) Copper Alloy - Surface Mount Open Frame Solder - - - - Thermoplastic Copper Alloy
256-1292-00-0602J

256-1292-00-0602J

CONN IC DIP SOCKET ZIF 56POS GLD

3M

1,753
256-1292-00-0602J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polysulfone (PSU), Glass Filled Beryllium Copper
260-4204-01

260-4204-01

CONN SOCKET QFN 60POS GOLD

3M

2,405
260-4204-01

Datasheet

Textool™ Bulk Active QFN 60 (4 x 15) Gold - Beryllium Copper 0.016" (0.40mm) Through Hole Open Frame Solder 0.016" (0.40mm) Gold - - Polyethersulfone (PES) Beryllium Copper
ICO-314-STT

ICO-314-STT

CONN IC DIP SOCKET 14POS TIN

Samtec Inc.

1,002
ICO-314-STT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C - Polyester, Glass Filled Brass
123-83-314-41-001101

123-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,471
123-83-314-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
4590

4590

CONN TRANSIST TO-5 3POS TIN

Keystone Electronics

1,338
4590

Datasheet

- Bulk Active Transistor, TO-5 3 (Round) Tin - Brass - Chassis Mount Closed Frame Solder - Tin - - Polyester, Glass Filled Brass
APA-314-T-A1

APA-314-T-A1

ADAPTER PLUG

Samtec Inc.

2,978
APA-314-T-A1

Datasheet

APA Bulk Active - 14 (2 x 7) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
299-83-308-10-001101

299-83-308-10-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

1,794
299-83-308-10-001101

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
ICO-320-MTT

ICO-320-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,144
ICO-320-MTT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C - Polyester, Glass Filled Brass
XR2C-2015

XR2C-2015

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

4,484
XR2C-2015

Datasheet

XR2 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polybutylene Terephthalate (PBT), Glass Filled Beryllium Copper
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