| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-43-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
4,980 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-93-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
2,527 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
FMC05DRTN-S1682CONN TRANSIST TO-220/TO-247 5POS |
1,614 |
|
Datasheet |
- | Tray | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | Gold | 30.0µin (0.76µm) | Nickel Boron | - | Through Hole | - | Solder | - | Gold | -65°C ~ 200°C | 30.0µin (0.76µm) | Polyphenylene Sulfide (PPS) | Nickel Boron |
|
APA-640-G-AADAPTER PLUG |
4,618 |
|
Datasheet |
APA | Bulk | Active | - | 40 (2 x 20) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 20.0µin (0.51µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
28-516-11CONN IC DIP SOCKET ZIF 28POS GLD |
2,414 |
|
Datasheet |
516 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Beryllium Copper |
|
16-2820-90CCONN IC DIP SOCKET 16POS GOLD |
2,477 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
123-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
1,709 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
28-526-11CONN IC DIP SOCKET ZIF 28POS GLD |
3,793 |
|
Datasheet |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Beryllium Copper |
|
232-1285-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD |
4,211 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
222-3343-00-0602JCONN IC DIP SOCKET ZIF 22POS GLD |
4,003 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
228-1290-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
1,714 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
242-1281-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD |
2,266 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
228-4817-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
2,248 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
242-1293-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD |
1,454 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
240-3639-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD |
1,783 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
220-7201-55-1902CONN SOCKET SOIC 20POS GOLD |
3,993 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 20 (2 x 10) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyethersulfone (PES), Glass Filled | Beryllium Copper |
|
242-1289-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD |
2,874 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
228-7396-55-1902CONN SOCKET SOIC 28POS GOLD |
2,552 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 28 (2 x 14) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyethersulfone (PES), Glass Filled | Beryllium Copper |
|
228-7474-55-1902CONN SOCKET SOIC 28POS GOLD |
1,741 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 28 (2 x 14) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyethersulfone (PES), Glass Filled | Beryllium Copper |
|
251-5949-01-0602CONN ZIG-ZAG ZIF 51POS GOLD |
4,700 |
|
Datasheet |
Textool™ | Bulk | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
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