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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
110-43-314-41-801000

110-43-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

1,129
110-43-314-41-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
299-93-308-10-001000

299-93-308-10-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,803
299-93-308-10-001000

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-93-640-41-001000

111-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,446
111-93-640-41-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-316-41-801000

110-43-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

1,433
110-43-316-41-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-13-314-41-001000

123-13-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

1,631
123-13-314-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
117-93-430-41-005000

117-93-430-41-005000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.

4,251
117-93-430-41-005000

Datasheet

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-320-41-801000

110-43-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2,671
110-43-320-41-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
299-93-314-11-001000

299-93-314-11-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

1,900
299-93-314-11-001000

Datasheet

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-93-324-41-001000

123-93-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

1,460
123-93-324-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-93-624-41-001000

123-93-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

4,863
123-93-624-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICO-628-NGT

ICO-628-NGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

3,941
ICO-628-NGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
110-13-314-41-801000

110-13-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

1,000
110-13-314-41-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
48-6518-10

48-6518-10

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

4,917
48-6518-10

Datasheet

518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
123-13-316-41-001000

123-13-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,277
123-13-316-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
08-823-90

08-823-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,130
08-823-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
XR2P2041

XR2P2041

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

1,763
XR2P2041

Datasheet

XR2 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Threaded - Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polybutylene Terephthalate (PBT), Glass Filled Brass
123-93-328-41-001000

123-93-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

1,714
123-93-328-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-93-628-41-001000

123-93-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

4,504
123-93-628-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
117-93-642-41-005000

117-93-642-41-005000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

3,318
117-93-642-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-13-320-41-801000

110-13-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

1,505
110-13-320-41-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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