| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
251-5949-02-0602CONN ZIG-ZAG ZIF 51POS GOLD |
4,354 |
|
Datasheet |
Textool™ | Bulk | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
361-PRS19001-12CONN SOCKET PGA ZIF GOLD |
4,604 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
248-4205-01CONN SOCKET QFN 48POS GOLD |
2,321 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 48 (4 x 12) | Gold | - | Beryllium Copper | 0.016" (0.40mm) | Through Hole | Closed Frame | Solder | - | Gold | - | - | Polyethersulfone (PES) | Beryllium Copper |
|
|
256-4205-01CONN SOCKET QFN 56POS GOLD |
3,742 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 56 (4 x 14) | Gold | - | Beryllium Copper | 0.016" (0.40mm) | Through Hole | Open Frame | Solder | 0.016" (0.40mm) | Gold | - | - | Polyethersulfone (PES) | Beryllium Copper |
|
|
280-5205-01CONN SOCKET QFN 80POS GOLD |
4,923 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 80 (4 x 20) | Gold | - | Beryllium Copper | 0.020" (0.50mm) | Through Hole | Open Frame | Solder | 0.020" (0.50mm) | Gold | - | - | Polyethersulfone (PES) | Beryllium Copper |
|
44-547-11ECONN SOCKET SOIC ZIF 44POS GOLD |
1,776 |
|
Datasheet |
547 | Bulk | Active | SOIC, ZIF (ZIP) | 44 (2 x 22) | Gold | 20.0µin (0.51µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | - | 20.0µin (0.51µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
110-47-306-41-001000CONN IC DIP SOCKET 6POS GOLD |
373 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
ED020PLCZCONN SOCKET PLCC 20POS TIN |
663 |
|
Datasheet |
ED | Tube | Active | PLCC | 20 (4 x 5) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
|
210-47-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
785 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
EDO-32PLCZSMCONN SOCKET PLCC 32POS |
712 |
|
Datasheet |
ED | Tube | Active | PLCC | 32 (2 x 16) | - | - | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | -55°C ~ 105°C | - | Polyphenylene Sulfide (PPS) | Phosphor Bronze |
|
111-47-306-41-001000CONN IC DIP SOCKET 6POS GOLD |
408 |
|
Datasheet |
111 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
115-47-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
377 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
06-0518-10HCONN SOCKET SIP 6POS GOLD |
1,164 |
|
Datasheet |
518 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
8432-21A1-RK-TPCONN SOCKET PLCC 32POS TIN |
3,567 |
|
Datasheet |
8400 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 160.0µin (4.06µm) | Copper Alloy | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polybutylene Terephthalate (PBT), Glass Filled | Copper Alloy |
|
SA486000CONN IC DIP SOCKET 48POS GOLD |
3,199 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Brass |
|
115-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
1,012 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
116-43-210-41-006000CONN IC DIP SOCKET 10POS GOLD |
4,645 |
|
Datasheet |
116 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
ICA-320-STTCONN IC DIP SKT 20POS |
3,425 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
|
32-6518-10CONN IC DIP SOCKET 32POS GOLD |
3,284 |
|
Datasheet |
518 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
ICF-318-T-OCONN IC DIP SOCKET 18POS TIN |
2,369 |
|
Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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