IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APA-640-G-P

APA-640-G-P

ADAPTER PLUG

Samtec Inc.

2,824
APA-640-G-P

Datasheet

APA Bulk Active - 40 (2 x 20) Gold 20.0µin (0.51µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 20.0µin (0.51µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
2174988-1

2174988-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

3,274
2174988-1

Datasheet

- Bulk Obsolete LGA 2011 (47 x 58) Gold 15.0µin (0.38µm) Copper Alloy 0.040" (1.02mm) Surface Mount Closed Frame Solder 0.035" (0.90mm) Gold - 15.0µin (0.38µm) Thermoplastic Copper Alloy
6-1437522-9

6-1437522-9

STAMPED PIN

TE Connectivity AMP Connectors

2,898
6-1437522-9

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
523-93-121-13-061001

523-93-121-13-061001

PGA SOCK 121PIN 13X13 WIRE WRAP

Mill-Max Manufacturing Corp.

295
523-93-121-13-061001

Datasheet

523 Bulk Active PGA 121 (13 x 13) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -
21218NE

21218NE

CONN IC DIP SOCKET 8POS

Marutsuelec

2,268
21218NE

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -40°C ~ 105°C - - -
212014NE

212014NE

CONN IC DIP SOCKET 14POS

Marutsuelec Co., Ltd.

1,214
212014NE

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -30°C ~ 85°C - - -
212016NE

212016NE

CONN IC DIP SOCKET 16POS

Marutsuelec Co., Ltd.

1,364
212016NE

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -30°C ~ 85°C - - -
212024WE

212024WE

CONN IC DIP SOCKET 24POS

Marutsuelec Co., Ltd.

1,892
212024WE

Datasheet

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -30°C ~ 85°C - - -
212114NE

212114NE

CONN IC DIP SOCKET 14POS

Marutsuelec

1,559
212114NE

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -40°C ~ 105°C - - -
212116NE

212116NE

CONN IC DIP SOCKET 16POS

Marutsuelec

1,764
212116NE

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -40°C ~ 105°C - - -
212124NE

212124NE

CONN IC DIP SOCKET 24POS

Marutsuelec

489
212124NE

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -40°C ~ 105°C - - -
212128NE

212128NE

CONN IC DIP SOCKET 28POS

Marutsuelec

1,023
212128NE

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -40°C ~ 105°C - - -
212132WE

212132WE

CONN IC DIP SOCKET 32POS

Marutsuelec

575
212132WE

Datasheet

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -40°C ~ 105°C - - -
212140WE

212140WE

CONN IC DIP SOCKET 40POS

Marutsuelec

216
212140WE

Datasheet

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) - - - 0.100" (2.54mm) Through Hole Open Frame - 0.100" (2.54mm) - -40°C ~ 105°C - - -
2-1571552-6

2-1571552-6

820-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

2,010
2-1571552-6

Datasheet

800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 180.0µin (4.57µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Copper
820-AG11D-ESL-LF

820-AG11D-ESL-LF

IC SOCKET, DIP20, 20 CONTACT(S),

TE Connectivity AMP Connectors

2,010
820-AG11D-ESL-LF

Datasheet

800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 180.0µin (4.57µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Copper
3-1571552-2

3-1571552-2

840-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

5,833
3-1571552-2

Datasheet

800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C Flash Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Copper
840-AG11D-ESL-LF

840-AG11D-ESL-LF

IC SOCKET, DIP40, 40 CONTACT(S),

TE Connectivity AMP Connectors

5,833
840-AG11D-ESL-LF

Datasheet

800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C Flash Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Copper
110-87-210-41-001101

110-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

416
110-87-210-41-001101

Datasheet

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SA203000

SA203000

CONN IC DIP SOCKET 20POS GOLD

On Shore Technology Inc.

645
SA203000

Datasheet

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 200.0µin (5.08µm) Thermoplastic, Polyester, Glass Filled Brass
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