| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
36-6501-31CONN IC DIP SOCKET 36POS GOLD |
2,507 |
|
Datasheet |
501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
ICO-640-ZAGG.100" LOW PROFILE SCREW MACHINE |
1,277 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
|
ICA-640-ZAGG.100" SCREW MACHINE DIP SOCKET |
1,862 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
|
HLS-0407-T-18.100" SCREW MACHINE SOCKET ARRAY |
4,481 |
|
Datasheet |
HLS | Bulk | Active | SIP | 28 (4 x 7) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
126-41-320-41-003000CONN IC SKT DBL |
3,820 |
|
Datasheet |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
126-41-420-41-003000CONN IC SKT DBL |
4,657 |
|
Datasheet |
126 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
126-91-320-41-003000CONN IC SKT DBL |
2,824 |
|
Datasheet |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
126-91-420-41-003000CONN IC SKT DBL |
3,148 |
|
Datasheet |
126 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
HLS-0220-T-32.100" SCREW MACHINE SOCKET ARRAY |
2,271 |
|
Datasheet |
HLS | Tube | Active | SIP | 40 (2 x 20) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
122-11-316-41-001000CONN IC SKT DBL |
4,912 |
|
Datasheet |
122 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
612-43-318-41-003000SKT CARRIER SOLDRTL |
4,749 |
|
Datasheet |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
612-93-318-41-003000SKT CARRIER SOLDRTL |
4,006 |
|
Datasheet |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-41-328-41-008000CONN IC SKT DBL |
4,785 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-41-428-41-008000CONN IC SKT DBL |
2,907 |
|
Datasheet |
116 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-41-628-41-008000CONN IC SKT DBL |
3,182 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-328-41-008000CONN IC SKT DBL |
2,189 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-428-41-008000CONN IC SKT DBL |
4,400 |
|
Datasheet |
116 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-628-41-008000CONN IC SKT DBL |
2,434 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
22-4503-31CONN IC DIP SOCKET 22POS GOLD |
1,970 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
24-0508-31CONN SOCKET SIP 24POS GOLD |
1,546 |
|
Datasheet |
508 | Bulk | Active | SIP | 24 (1 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
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