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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
24-1508-31

24-1508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,823
24-1508-31

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
714-43-228-31-018000

714-43-228-31-018000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,479
714-43-228-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0508-T-11

HLS-0508-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,924
HLS-0508-T-11

Datasheet

HLS Bulk Active SIP 40 (5 x 8) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
ICA-628-ZHGT

ICA-628-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,183
ICA-628-ZHGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
126-93-320-41-002000

126-93-320-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

1,146
126-93-320-41-002000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-93-420-41-002000

126-93-420-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

4,181
126-93-420-41-002000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-43-320-41-002000

126-43-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,469
126-43-320-41-002000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-43-420-41-002000

126-43-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,801
126-43-420-41-002000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-1924-T-R

APH-1924-T-R

APH-1924-T-R

Samtec Inc.

1,599
APH-1924-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1024-T-R

APH-1024-T-R

APH-1024-T-R

Samtec Inc.

4,592
APH-1024-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1124-T-R

APH-1124-T-R

APH-1124-T-R

Samtec Inc.

1,165
APH-1124-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1724-T-R

APH-1724-T-R

APH-1724-T-R

Samtec Inc.

3,048
APH-1724-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1224-T-R

APH-1224-T-R

APH-1224-T-R

Samtec Inc.

2,744
APH-1224-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0224-T-R

APH-0224-T-R

APH-0224-T-R

Samtec Inc.

3,577
APH-0224-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
614-87-124-13-041112

614-87-124-13-041112

CONN SOCKET PGA 124POS GOLD

Preci-Dip

4,655
614-87-124-13-041112

Datasheet

614 Bulk Active PGA 124 (13 x 13) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,542
21-0503-21

Datasheet

0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA), Nylon, Glass Filled Brass
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2,747
21-0503-31

Datasheet

0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA), Nylon, Glass Filled Brass
126-41-318-41-003000

126-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,111
126-41-318-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-91-318-41-003000

126-91-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,315
126-91-318-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
517-87-321-17-101111

517-87-321-17-101111

CONN SOCKET PGA 321POS GOLD

Preci-Dip

3,242
517-87-321-17-101111

Datasheet

517 Bulk Active PGA 321 (17 x 17) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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