| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
28-0508-21CONN SOCKET SIP 28POS GOLD |
2,627 |
|
Datasheet |
508 | Bulk | Active | SIP | 28 (1 x 28) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
28-0508-31CONN SOCKET SIP 28POS GOLD |
4,531 |
|
Datasheet |
508 | Bulk | Active | SIP | 28 (1 x 28) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
28-1508-21CONN IC DIP SOCKET 28POS GOLD |
1,775 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
28-1508-31CONN IC DIP SOCKET 28POS GOLD |
2,280 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
614-41-642-31-002000SKT CARRIER PGA |
1,078 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
614-91-642-31-002000SKT CARRIER PGA |
1,550 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
ICO-640-ZCGG.100" LOW PROFILE SCREW MACHINE |
3,518 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
|
605-93-636-11-480000SOCKET CARRIER LOWPRO .600 36POS |
3,940 |
|
Datasheet |
605 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
605-43-636-11-480000SKT CARRIER LOWPRO |
4,146 |
|
Datasheet |
605 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-93-648-41-006000CONN IC DIP SOCKET 48POS GOLD |
3,912 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-43-648-41-006000CONN IC SKT DBL |
2,120 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
614-41-642-31-007000SKT CARRIER PGA |
1,867 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
614-91-642-31-007000SKT CARRIER PGA |
1,975 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
111-41-964-41-001000CONN IC SKT DBL |
3,274 |
|
Datasheet |
111 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
111-91-964-41-001000CONN IC SKT DBL |
1,447 |
|
Datasheet |
111 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
117-41-664-41-005000CONN IC SKT DBL |
4,414 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
117-41-764-41-005000CONN IC SKT DBL |
4,730 |
|
Datasheet |
117 | Tube | Active | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
117-91-664-41-005000CONN IC SKT DBL |
1,410 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
117-91-764-41-005000CONN IC SKT DBL |
3,857 |
|
Datasheet |
117 | Tube | Active | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-43-640-41-007000CONN IC SKT DBL |
2,056 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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