| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APA-628-G-MADAPTER PLUG |
4,468 |
|
Datasheet |
APA | Tube | Active | - | 28 (2 x 14) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 20.0µin (0.51µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
28-3553-11CONN IC DIP SOCKET ZIF 28POS GLD |
1,762 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
28-6551-11CONN IC DIP SOCKET ZIF 28POS GLD |
2,406 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
28-6552-11CONN IC DIP SOCKET ZIF 28POS GLD |
1,744 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
28-6553-11CONN IC DIP SOCKET ZIF 28POS |
4,501 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
28-3554-11CONN IC DIP SOCKET ZIF 24POS GLD |
4,274 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 250°C | - | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
115-41-964-41-001000CONN IC SKT DBL |
2,866 |
|
Datasheet |
115 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
115-91-964-41-001000SKT IC OPEN LOWPRO |
4,512 |
|
Datasheet |
115 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
40-6556-3040 POS TEST SOCK RECEPT SOLDER |
4,961 |
|
Datasheet |
6556 | - | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
40-6556-20CONN IC DIP SOCKET 40POS GOLD |
2,268 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
121-11-432-41-001000CONN IC SKT DBL |
3,460 |
|
Datasheet |
121 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
121-11-632-41-001000CONN IC SKT DBL |
1,495 |
|
Datasheet |
121 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-41-650-41-007000CONN IC SKT DBL |
4,096 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-91-650-41-007000CONN IC SKT DBL |
2,994 |
|
Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
614-41-642-31-018000SKT CARRIER PGA |
1,682 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
614-91-642-31-018000SKT CARRIER PGA |
2,431 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-99-310-61-001000CONN IC SKT DBL |
2,109 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
38-6823-90TCONN IC DIP SOCKET 38POS TIN |
2,252 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 38 (2 x 19) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6 | Phosphor Bronze |
|
|
614-41-640-41-001000SKT CARRIER PGA |
3,935 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
614-91-640-41-001000SKT CARRIER PGA |
3,918 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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