| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2T-2021-NCONN IC DIP SOCKET 20POS GOLD |
1,201 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | Flash | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
|
|
XR2A-1625CONN IC DIP SOCKET 16POS GOLD |
3,324 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | Flash | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
|
|
ICO-316-SGG.100" LOW PROFILE SCREW MACHINE |
4,014 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
XR2A-0802CONN IC DIP SOCKET 8POS GOLD |
1,065 |
|
Datasheet |
XR2 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 29.5µin (0.75µm) | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
|
524-AG11D-ESCONN IC DIP SOCKET 24POS GOLD |
1,100 |
|
Datasheet |
500 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Copper Alloy |
|
|
3-1571551-2CONN IC DIP SOCKET 40POS GOLD |
4,459 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Nickel |
|
|
528-AG12DCONN IC DIP SOCKET 28POS TIN |
2,024 |
|
Datasheet |
500 | Tray | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester | Beryllium Copper |
|
110-13-318-41-801000CONN IC DIP SOCKET 18POS GOLD |
4,138 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
848-AG10DCONN IC DIP SOCKET 48POS GOLD |
4,947 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | Copper Alloy |
|
299-93-318-10-001000CONN IC DIP SOCKET 18POS GOLD |
2,043 |
|
Datasheet |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
299-43-616-10-002000CONN IC DIP SOCKET 16POS GOLD |
1,390 |
|
Datasheet |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
117-43-652-41-005000CONN IC DIP SOCKET 52POS GOLD |
4,761 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
2043650006P&S Conn 6MM CST SMT SOCKET W/1M |
3,342 |
|
Datasheet |
* | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
3-1571550-2CONN IC DIP SOCKET 40POS GOLD |
1,997 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Beryllium Copper |
|
|
8060-1G9CONN TRANSIST TO-5 3POS GOLD |
3,605 |
|
Datasheet |
8060 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | Gold | - | Beryllium Copper | - | Panel Mount | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polytetrafluoroethylene (PTFE) | Beryllium Copper |
|
|
2-1437504-68060-1G9=GOLD TRANSISTOR SOCKE |
2,491 |
|
Datasheet |
8060 | Bulk | Active | Transistor, TO-5 | 3 (Round) | Gold | - | Beryllium Copper | - | Panel Mount | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polytetrafluoroethylene (PTFE) | Beryllium Copper |
|
110-13-628-41-801000CONN IC DIP SOCKET 28POS GOLD |
2,421 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
2040540-2CONN SOCKET LGA 1156POS GOLD |
3,037 |
|
Datasheet |
- | Tray | Active | LGA | 1156 (34 x 34) | Gold | Flash | Copper Alloy | 0.036" (0.91mm) | Surface Mount | Closed Frame | Solder | 0.039" (1.00mm) | - | - | - | Thermoplastic | Copper Alloy |
|
117-43-664-41-005000CONN IC DIP SOCKET 64POS GOLD |
4,382 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
APA-324-G-NADAPTER PLUG |
3,369 |
|
Datasheet |
APA | Bulk | Active | - | 24 (2 x 12) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 20.0µin (0.51µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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