| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
104670-0041Socket-NAND 152 14.0 x 18.0 -1.0 |
4,200 |
|
Datasheet |
Grypper | Bag | Active | PGA | 152 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
108656-0036Socket-NAND 152 14.0 x 18.0 -1.0 |
4,563 |
|
Datasheet |
Grypper | Bag | Active | PGA | 152 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
212018NECONN IC DIP SOCKET 18POS |
840 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -30°C ~ 85°C | - | - | - |
|
|
212020NECONN IC DIP SOCKET 20POS |
778 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -30°C ~ 85°C | - | - | - |
|
|
212028WECONN IC DIP SOCKET 28POS |
848 |
|
Datasheet |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -30°C ~ 85°C | - | - | - |
|
|
212024NECONN IC DIP SOCKET 24POS |
402 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -30°C ~ 85°C | - | - | - |
|
|
212028NECONN IC DIP SOCKET 28POS |
381 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -30°C ~ 85°C | - | - | - |
|
|
212040WECONN IC DIP SOCKET 40POS |
209 |
|
Datasheet |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -30°C ~ 85°C | - | - | - |
|
|
212118NECONN IC DIP SOCKET 18POS |
126 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -40°C ~ 105°C | - | - | - |
|
|
212120NECONN IC DIP SOCKET 20POS |
690 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -40°C ~ 105°C | - | - | - |
|
|
212124WECONN IC DIP SOCKET 24POS |
486 |
|
Datasheet |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -40°C ~ 105°C | - | - | - |
|
|
212128WECONN IC DIP SOCKET 28POS |
358 |
|
Datasheet |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | - | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | -40°C ~ 105°C | - | - | - |
|
|
CAP-002-04-000402 Capcitor Test Socket |
1,852 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
108493-0009DDR Socket, 78 BGA 7.5 mm x 10.6 |
1,216 |
|
Datasheet |
Grypper | Bag | Active | BGA | 78 (6 x 13) | - | - | - | 0.031" (0.80mm) | - | - | Solder | - | - | - | - | - | - |
|
|
104670-0040Socket-NAND 12.0 x 18.0 -1.0 SAC |
3,392 |
|
Datasheet |
Grypper | Bag | Active | PGA | 132 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
104670-0043Socket-NAND 12.0 x 18.0 -1.0 pi |
4,313 |
|
Datasheet |
Grypper | Bag | Active | PGA | 132 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
108387-0026Socket-eMMC/UFS,153 BGA 11.5 mm |
2,390 |
|
Datasheet |
- | Bag | Active | BGA | 153 (12 x 13) | - | - | - | 0.020" (0.50mm) | Through Hole | - | Solder | 0.020" (0.50mm) | - | - | - | - | - |
|
|
107250-0059Socket-eMMC/UFS, 153 BGA 10.0 mm |
2,013 |
|
Datasheet |
- | Bag | Active | BGA | 153 (12 x 13) | - | - | - | 0.020" (0.50mm) | Through Hole | - | Solder | 0.020" (0.50mm) | - | - | - | - | - |
|
A 08-LC-TTCONN IC DIP SOCKET 8POS TIN |
2,573 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
|
110-41-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
3,655 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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