| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SA326040CONN IC DIP SOCKET 32POS GOLD |
2,347 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | 80.0µin (2.03µm) | Thermoplastic, Polyester, Glass Filled | Brass |
|
PLCC-68-ATPLCC 68P THROUGH HOLE |
4,344 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 68 (4 x 17) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 80.0µin (2.03µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
SA406040CONN IC DIP SOCKET 40POS GOLD |
1,677 |
|
Datasheet |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | 80.0µin (2.03µm) | Thermoplastic, Polyester, Glass Filled | Brass |
|
28-6518-10CONN IC DIP SOCKET 28POS GOLD |
2,355 |
|
Datasheet |
518 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
917-43-108-41-005000CONN TRANSIST TO-5 8POS GOLD |
1,744 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-5 | 8 (Round) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
382CONN IC DIP SOCKET 28POS |
2,029 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
28-3518-10CONN IC DIP SOCKET 28POS GOLD |
1,001 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
MIKROE-42540 PIN ZIF SOCKET |
3,312 |
|
Datasheet |
- | Box | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | - | - | - | - | Through Hole | Closed Frame | Solder | - | - | - | - | - | - |
|
4732COVER PWR TRANS .210"ID TO-3 |
2,407 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
224-1286-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
4,654 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
224-5248-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
1,041 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
214-7390-55-1902CONN SOCKET SOIC 14POS GOLD |
2,716 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 14 (2 x 7) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyethersulfone (PES), Glass Filled | Beryllium Copper |
|
228-1371-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
2,805 |
|
Datasheet |
Textool™ | Tray | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
216-5205-01CONN SOCKET QFN 16POS GOLD |
2,243 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 16 (3x3) | Gold | - | Beryllium Copper | 0.020" (0.50mm) | Through Hole | - | Solder | - | Gold | - | - | Polyethersulfone (PES) | Beryllium Copper |
|
|
228-5204-01CONN SOCKET QFN 28POS GOLD |
3,093 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 28 (4 x 7) | Gold | - | Beryllium Copper | 0.020" (0.50mm) | Through Hole | - | Solder | - | Gold | - | - | Polyethersulfone (PES) | Beryllium Copper |
|
115-93-308-41-003000CONN IC DIP SOCKET 8POS GOLD |
3,735 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
940-44-020-17-400000CONN SOCKET PLCC 20POS TIN |
4,399 |
|
Datasheet |
940 | Tube | Active | PLCC | 20 (4 x 5) | Tin | 150.0µin (3.81µm) | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
214-99-316-01-670800CONN IC DIP SOCKET 16POS TINLEAD |
2,490 |
|
Datasheet |
214 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
XR2A-1411-NCONN IC DIP SOCKET 14POS GOLD |
1,787 |
|
Datasheet |
XR2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
|
AR 16-HZW/TNCONN IC DIP SOCKET 16POS GOLD |
2,741 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
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