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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
60-9513-11H

60-9513-11H

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

3,409
60-9513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
APH-0432-T-R

APH-0432-T-R

APH-0432-T-R

Samtec Inc.

1,631
APH-0432-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1832-T-R

APH-1832-T-R

APH-1832-T-R

Samtec Inc.

4,927
APH-1832-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0932-T-R

APH-0932-T-R

APH-0932-T-R

Samtec Inc.

2,745
APH-0932-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1032-T-R

APH-1032-T-R

APH-1032-T-R

Samtec Inc.

1,942
APH-1032-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1932-T-R

APH-1932-T-R

APH-1932-T-R

Samtec Inc.

4,477
APH-1932-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0632-T-R

APH-0632-T-R

APH-0632-T-R

Samtec Inc.

3,557
APH-0632-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1632-T-R

APH-1632-T-R

APH-1632-T-R

Samtec Inc.

3,358
APH-1632-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1232-T-R

APH-1232-T-R

APH-1232-T-R

Samtec Inc.

1,117
APH-1232-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1132-T-R

APH-1132-T-R

APH-1132-T-R

Samtec Inc.

2,512
APH-1132-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
614-41-648-31-012000

614-41-648-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,212
614-41-648-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-91-648-31-012000

614-91-648-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,521
614-91-648-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-93-650-41-003000

116-93-650-41-003000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

4,972
116-93-650-41-003000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-650-41-003000

116-43-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,296
116-43-650-41-003000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
546-87-192-14-001135

546-87-192-14-001135

CONN SOCKET PGA 192POS GOLD

Preci-Dip

3,567
546-87-192-14-001135

Datasheet

546 Bulk Active PGA 192 (14 x 14) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
546-87-192-14-001136

546-87-192-14-001136

CONN SOCKET PGA 192POS GOLD

Preci-Dip

1,944
546-87-192-14-001136

Datasheet

546 Bulk Active PGA 192 (14 x 14) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
APO-422-G-R

APO-422-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,021
APO-422-G-R

Datasheet

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
116-93-642-41-008000

116-93-642-41-008000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

3,273
116-93-642-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-642-41-008000

116-43-642-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,305
116-43-642-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-41-642-41-001000

612-41-642-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,704
612-41-642-41-001000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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