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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
    42-3572-10

    42-3572-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,528
    RFQ Sell Excess Inventory
    		42-3572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-3573-10

    42-3573-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 1,567
    RFQ Sell Excess Inventory
    		42-3573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-3574-10

    42-3574-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,253
    RFQ Sell Excess Inventory
    		42-3574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-3575-10

    42-3575-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,564
    RFQ Sell Excess Inventory
    		42-3575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-6570-10

    42-6570-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,062
    RFQ Sell Excess Inventory
    		42-6570-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-6571-10

    42-6571-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 1,620
    RFQ Sell Excess Inventory
    		42-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-6572-10

    42-6572-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 4,913
    RFQ Sell Excess Inventory
    		42-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-6573-10

    42-6573-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,707
    RFQ Sell Excess Inventory
    		42-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-6574-10

    42-6574-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 1,794
    RFQ Sell Excess Inventory
    		42-6574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-6575-10

    42-6575-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,851
    RFQ Sell Excess Inventory
    		42-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    30-0508-21

    30-0508-21

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 4,874
    RFQ Sell Excess Inventory
    		30-0508-21

    Datasheet

         		508 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
    30-0508-31

    30-0508-31

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 3,819
    RFQ Sell Excess Inventory
    		30-0508-31

    Datasheet

         		508 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
    42-6556-11

    42-6556-11

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 3,472
    RFQ Sell Excess Inventory
    		42-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
    32-0501-21

    32-0501-21

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 4,902
    RFQ Sell Excess Inventory
    		32-0501-21

    Datasheet

         		501 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
    32-0501-31

    32-0501-31

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 1,095
    RFQ Sell Excess Inventory
    		32-0501-31

    Datasheet

         		501 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
    110-13-328-41-801000

    110-13-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,768
    RFQ Sell Excess Inventory
    		110-13-328-41-801000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    115-43-210-61-001000

    115-43-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,558
    RFQ Sell Excess Inventory
    		115-43-210-61-001000

    Datasheet

         		115 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    30-1508-21

    30-1508-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 4,484
    RFQ Sell Excess Inventory
    		30-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
    30-1508-31

    30-1508-31

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 3,749
    RFQ Sell Excess Inventory
    		30-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
    HLS-0407-G-11

    HLS-0407-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,292
    RFQ Sell Excess Inventory
    		HLS-0407-G-11

    Datasheet

         		HLS Bulk Active SIP 28 (4 x 7) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
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